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Transferwear During Cu CMP

Published online by Cambridge University Press:  01 February 2011

H. Liang,
G. Helen Xu,
J.M. Martin and
Th. Le Mongne
H. Liang
Affiliation:
University of Alaska Fairbanks
G. Helen Xu
Affiliation:
University of Alaska Fairbanks
J.M. Martin
Affiliation:
Ecole Central de Lyon
Th. Le Mongne
Affiliation:
Ecole Central de Lyon
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Extract

We conducted fundamental investigation of interfacial interactions between copper and polyurethane surfaces. Using in situ surface analysis techniques we were able to evaluate effects of water molecules on both materials surfaces during rubbing. Evidence of transferring elements between copper and urethane surfaces due to friction was found. Further investigation on pad wear indicated that transfer wear was taking a major role during copper CMP and mixed wear modes dominated pad wear.

Keywords

pad weartransfer layertribochemistryCu CMP.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003, F2.7
Copyright
Copyright © Materials Research Society 2003

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