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Understanding Multi Scale Pad Effects in Chemical Mechanical Planarization

Published online by Cambridge University Press:  31 January 2011

Abhijit Chandra,
Ashraf. F. Bastawros and
Pavan K. Karra
Abhijit Chandra
Affiliation:
achandra@iastate.edu, Iowa State University, 2025 Black Engineering, Ames, Iowa, 50011, United States
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Abstract

A multi-physics model encompassing chemical dissolution and mechanical abrasion effects in CMP is developed. This augments a previously developed multi-scale model accounting for both pad response and slurry behavior evolution. The augmented model is utilized to predict scratch propensity in a CMP process. The pad response delineates the interplay between the local particle level deformation and the cell level bending of the pad. The slurry agglomerates in the diffusion limited agglomeration (DLA) or reaction limited agglomeration (RLA) regime. Various nano-scale slurry properties significantly influence the spatial and temporal modulation of the material removal rate (MRR) and scratch generation characteristics. The model predictions are first validated against experimental observations. A parametric study is then undertaken. Such physically based models can be utilized to optimize slurry and pad designs to control the depth of generated scratches and their frequency of occurrence per unit area.

Keywords

machiningnano-indentationnanoscale

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