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Vacancy Promoted Interdiffusion in Quantum Wells and Applications to Optoelectronic Devices

Published online by Cambridge University Press:  03 September 2012

M. Ghisoni
Affiliation:
University of London Interdisciplinary Research Centre for Semiconductor Materials, Department of Electronic and Electrical Engineering, University College London, London WC1E 7JE, U.K.
A. W. Rivers
Affiliation:
University of London Interdisciplinary Research Centre for Semiconductor Materials, Department of Electronic and Electrical Engineering, University College London, London WC1E 7JE, U.K.
K. Lee
Affiliation:
University of London Interdisciplinary Research Centre for Semiconductor Materials, Department of Electronic and Electrical Engineering, University College London, London WC1E 7JE, U.K.
G. Parry
Affiliation:
University of London Interdisciplinary Research Centre for Semiconductor Materials, Department of Electronic and Electrical Engineering, University College London, London WC1E 7JE, U.K.
X. Zhang
Affiliation:
University of London Interdisciplinary Research Centre for Semiconductor Materials, Department of Materials, Imperial College of Science Technology and Medicine, London SW7 2BP, U. K.
A. Staton-Bevan
Affiliation:
University of London Interdisciplinary Research Centre for Semiconductor Materials, Department of Materials, Imperial College of Science Technology and Medicine, London SW7 2BP, U. K.
M. Pate
Affiliation:
SERC Central Facility for III-V Materials, University of Sheffield, Sheffield SI 3JD, U.K.
G. Hill
Affiliation:
SERC Central Facility for III-V Materials, University of Sheffield, Sheffield SI 3JD, U.K.
C. Button
Affiliation:
SERC Central Facility for III-V Materials, University of Sheffield, Sheffield SI 3JD, U.K.
J. S. Roberts
Affiliation:
SERC Central Facility for III-V Materials, University of Sheffield, Sheffield SI 3JD, U.K.
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Abstract

In this paper we shall look at a technique, known as impurity free vacancy diffusion (IFVD) for selectively altering the optoelectronic response of quantum well material after growth with a view to monolithic device integration. We will discuss the mechanism, practical considerations and some possible applications.

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