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Wireless and RF Module Packaging using Low Loss Ceramic and Low Loss Organic Materials

Published online by Cambridge University Press:  01 February 2011

James J. Logothetis,
Daniel I. Amey and
Timothy P. Mobley
James J. Logothetis
Affiliation:
Merrimac Industries Inc., West Caldwell, NJ
Daniel I. Amey
Affiliation:
Merrimac Industries Inc., West Caldwell, NJ
Timothy P. Mobley
Affiliation:
DuPont Microcircuit Materials Research, Triangle Park, NC
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Abstract

This presentation describes the basics of Multi-Mix® and Green Tape™ Low Temperature Cofired Ceramic (LTCC) technologies. The design and performance of a 28 GHz mixer package using a GaAs MMIC and the 943 Green Tape™ LTCC system with embedded capacitance technology is described including the tradeoffs, advantages and compatibility of Multi-Mix® and Green Tape™ technologies. A design approach combining the technologies offers the designer new options to meet the ever-increasing demands of high frequency packaging.

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References

REFERENCES

[1] Felten, J. J. “Advanced Embedded Passives Technologies - Putting Ceramic Components into Organic PWB's” ECWC9 Paper IPC31, October 2002, Cologne Germany Google Scholar
[2] Needes, C.R.S., Amey, D.I. and Horowitz, S.J. “Cost Effective Solutions for High Density Interconnect and RF Modules Using Low Temperature Cofired Ceramic Materials” IMC/IEMT Conference, April 2000 Google Scholar
[3] Donohue, P.C et.al., “A new Low Loss Lead Free LTCC System for Wireless and RF Applications”, Proceedings of the 1998 International Conference on Multichip Modules and High Density Packaging, pp 196–199, 1998 Google Scholar
[4] Amey, D.I., Keating, M.Y., Smith, M.A., Horowitz, S.J., Donahue, P.C. and Needes, C.R.S. “Low Loss Tape Material System for 10 to 40 GHz Application” 2000 Proceedings of the International Symposium on Microelectronics, pp 654–658 Google Scholar
[5] Hittite Microwave Corporation, HMC264 Product Specification sheetGoogle Scholar
[6] Schaper, L.W., Amey, D.I., “Improved Electrical Performance Required for Future MOS Packaging”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. CHMT–6, No. 3, September 1983 Google Scholar