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Strong visible light emission from silicon-oxycarbide nanowire arrays prepared by electron beam lithography and reactive ion etching

Published online by Cambridge University Press:  20 November 2015

Vasileios Nikas
Affiliation:
Colleges of Nanoscale Sciences and Engineering, State University of New York Polytechnic Institute, Albany, New York 12203, USA
Natasha Tabassum
Affiliation:
Colleges of Nanoscale Sciences and Engineering, State University of New York Polytechnic Institute, Albany, New York 12203, USA
Brian Ford
Affiliation:
Colleges of Nanoscale Sciences and Engineering, State University of New York Polytechnic Institute, Albany, New York 12203, USA
Lloyd Smith
Affiliation:
IBM Microelectronics, Semiconductor Research and Development Center, Hopewell Junction, New York 12533, USA
Alain E. Kaloyeros
Affiliation:
Colleges of Nanoscale Sciences and Engineering, State University of New York Polytechnic Institute, Albany, New York 12203, USA
Spyros Gallis*
Affiliation:
Colleges of Nanoscale Sciences and Engineering, State University of New York Polytechnic Institute, Albany, New York 12203, USA
*
a) Address all correspondence to this author. e-mail: sgalis@sunypoly.edu

Abstract

The present report presents results from the fabrication, structural, and optical characteristics of sub-100 nm thermal chemical vapor deposition-grown silicon-oxycarbide (SiCx Oy ) nanowire (NW) arrays fabricated by e-beam lithography and reactive-ion-etching. The composition of SiCx Oy materials follows closely the silicon-oxycarbide stoichiometry [SiCx O2(1−x), (0 < x < 1)] as observed by compositional and structural analysis. The corresponding structural and bonding evolution of SiCx Oy are well-correlated with changes in their optical properties, as demonstrated by the linear dependence of their optical gap and refractive index with [Si–C]/[Si–O] bond–area ratio. By virtue of these advantages, properly tailored SiCx Oy NWs were fabricated, exhibiting strong room-temperature visible photoluminescence (PL) through engineering of [Si–C]/[Si–O] bonds. The current studies focused on the thermal-oxidation and excitation intensity behavior of SiCx Oy NWs revealed their very good stability, as their luminescence characteristics remain unchanged upon annealing in oxygen ambient (250 °C), while the PL intensity dependence on the excitation power-density exhibited a linear increase up to ∼800 W/cm2.

Information

Type
Invited Feature Paper
Copyright
Copyright © Materials Research Society 2015 
Figure 0

FIG. 1. (a–d) Schematic representation of the fabrication steps of SiCxOy NWs: (a) deposition of 120 nm-thick SiCxOy thin film on substrate, (b) spin-coating of HSQ resist, (c) pattern fabrication on the resist, and development in 2.38% TMAH solution and (d) RIE-etch of HSQ mask resulting in 120 nm-thick SiCxOy NW arrays; (e) top-down and (f) low magnification cross-section scanning electron microscope (SEM) images of the RIE-etched SiCxOy NWs with ∼70 nm width (FWHM) and 400 nm pitch and (g) high magnification cross-section SEM image of single 70 nm-width NW (the cross sections were made with a focused ion beam—the structures were covered with Pt prior to cutting).

Figure 1

TABLE I. Elemental composition and stoichiometry of representative thermal CVD-grown SiCxOy samples at different deposition process parameters (precursor flow rate: 10 sccm; Ar flow rate: 450 sccm; and deposition temperature: 800 °C).

Figure 2

FIG. 2. Si–C–O ternary diagram with the compositions of AD silicon oxycarbide (SiCxOy) materials as they were determined by XPS and RBS measurements. The solid line shows the composition of the stoichiometric silicon oxycarbide, SiCxO2(1−x) (0 < x < 1), along with the positions of the SiO2 and SiC, for respectively, x = 0 and x = 1.

Figure 3

FIG. 3. (a) The [Si–C]/[Si–O] bond–area ratio plotted as a function of the C/O content ratio showing a linear increase with increasing C/O; (b) The FTIR absorptions of the Si–O–C bonding configuration around ∼437 cm−1 of AD SiCxOy for different C contents. For comparison purposes the FTIR absorption of a thermally-grown SiO2 control sample is also displayed (dotted gray line). The peak positions of the AD SiCxOy appear red-shifted compared to the SiO2 control, due to the incorporation of less electronegative C. The increase of the C content in SiCxOy results in the decrease in the Si–O–C intensity; (c) The FTIR absorption spectra of the AD SiCxOy and SiO2 control in the 550–1600 cm−1 range. The inset displays the TO Si–O vibration frequency versus C content.

Figure 4

FIG. 4. (a) E04 and Tauc Eg energy values for different SiCxOy materials versus the [Si–C]/[Si–O] bond ratio. The Eg was determined based on the Tauc's equation, (αhν)1/2 = B1/2(hν − Eg), where α is the absorption coefficient, hν is the photon energy and B is the slope, which is inverse proportional to the width of the tail band. The solid lines depict the linear [Si–C]/[Si–O] dependence; (b) the index of refraction at 800 nm of different SiCxOy given as a function of the [Si–C]/[Si–O] bond ratio. The solid line is the linear fit of the displayed data.

Figure 5

FIG. 5. Normalized FTIR absorbance spectra of 70 nm-width SiC0.34O1.52 NW array and its thin film counterpart. In the inset an SEM image of the 3 × 3 mm2 array used for the measurement is shown, which consists of 36 blocks of 490 × 490 μm2 NW arrays with 10 μm spacing between the blocks.

Figure 6

FIG. 6. (a) Room-temperature PLE spectra of 120 nm-thick SiC0.34O1.52 thin film and its corresponding 70 nm-width SiC0.34O1.52 NWs (400 nm pitch) measured at its emission peak; (b) room-temperature PL spectrum of the as-fabricated SiC0.34O1.52 NWs excited at λexc = 457 nm. The inset shows the camera photo of the observed strong visible PL under blue light excitation and its corresponding optical photo. The dimension of the studied NW array structure is 50 μm × 500 μm and the PL photo was taken with a common camera with the use of an optical setup equipped with a 50× lens and a 475 nm long-wave pass filter.

Figure 7

FIG. 7. PL spectra of the AD and 2 h-oxygen-annealed SiC0.34O1.52 NW at various temperatures (excitation wave length λexc = 457 nm). The inset shows the integrated PL intensity versus annealing temperature.

Figure 8

FIG. 8. Room-temperature PL spectra of the 70 nm-width SiC0.34O1.52 NWs for different cw excitation probing power-densities (excited at the λexc = 457.9 nm of an Ar ion laser). The inset shows the linear behavior of the integrated PL intensity as a function of the excitation power density.