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Thermodynamically admissible diffuse interface model for nanoscale transport of dense fluids

Published online by Cambridge University Press:  05 March 2026

Rahul Bhattacharjee
Affiliation:
Department of Mathematics, Birla Institute of Technology and Science Pilani , Rajasthan 333031, India
Henning Struchtrup
Affiliation:
Department of Mechanical Engineering, University of Victoria, PO Box 1700 STN CSC, Victoria, V8W 2Y2, BC, Canada
Anirudh Singh Rana*
Affiliation:
Department of Mathematics, Birla Institute of Technology and Science Pilani , Rajasthan 333031, India
*
Corresponding author: Anirudh Singh Rana, anirudh.rana@pilani.bits-pilani.ac.in

Abstract

We investigate the interfacial fluid dynamics and heat transfer at nanoscales using an improved diffuse interface approach for liquid–vapour interfaces in non-equilibrium. Conventional Navier–Stokes–Korteweg (NSK) formulations often fail to accurately capture transport phenomena across extremely thin interfaces due to underestimation of interface resistances. In this work, we improve the NSK model by adding a production term in the momentum equation based on higher-order corrections. To enhance interface resistances, viscosity and thermal conductivity are made dependent on the density gradient, increasing resistance only within the interface region. The gradient-based coefficients are determined by fitting to solutions of the Enskog–Vlasov equation for Couette flow of Struchtrup & Frezzotti (2022 J. Fluid Mech., vol. 940, p. A40). Applying these fitted equations to pure heat conduction and planar evaporation problems shows that the model accurately captures interfacial transport, making it a useful tool for studying nanoscale evaporation, thermal management and the droplet dynamics on solid surfaces.

Information

Type
JFM Papers
Copyright
© The Author(s), 2026. Published by Cambridge University Press
Figure 0

Figure 1. The saturation curve is shown in cyan, with grey lines depicting isotherms at $ \theta = 0.85, 0.75,{} 0.63, 0.60$, arranged from top to bottom in the $ p$–$ v$ diagram. The critical point is indicated by a red marker.

Figure 1

Figure 2. Two-phase Couette flow: comparison of EV-DSMC (black diamonds), ANSK model (black solid line), model 1 (red dashed line) and model 2 (blue dot-dashed line). (a) Velocity profiles for $\theta = 0.55$ (b) Velocity profiles for $\theta = 0.60$ (c) Velocity profiles for $\theta =0.65$ (top row and bottom left); shear stress at $\theta = 0.60$ (bottom right).

Figure 2

Figure 3. Profiles of the density gradient $ |\boldsymbol{\nabla }\rho (x)|$ across the liquid–vapour interface for different dimensionless temperatures $ \theta = 0.45, 0.55, 0.65, 0.75$.

Figure 3

Figure 4. Profiles of the coefficient of viscosity for liquid $\mu _{l}$, and vapour $\mu _{v}$ versus dimensionless temperature $\theta$.

Figure 4

Figure 5. Coefficient of viscosity as a function of temperature at constant pressure. The bottom red solid curve is the ideal gas case where viscosity is independent of pressure.

Figure 5

Figure 6. Comparison of coefficient of viscosity (a) and thermal conductivity (b) computed from ANSK model (black solid line) and model 1 (red dashed line) for $\theta = 0.55, 0.60\, \text{and}\,0.65$.

Figure 6

Figure 7. Comparison of coefficient of viscosity (a) and thermal conductivity (b) computed from EV formulation (green solid line) and NSF framework (red dashed line) for $\theta = 0.55, 0.60\, \text{and}\,0.65$.

Figure 7

Table 1. Values of $L_{{\textit{HS}},v}$, the hard-sphere mfp of the saturated vapour phase, 99 % interface thickness $L_{99\,\%}$ and Knudsen number ${Kn}$ for different dimensionless temperatures $\theta$. The suffix ${\textit{HS}},v$ denotes hard-sphere saturated vapour.

Figure 8

Figure 8. Comparison of coefficient of viscosity (a) and thermal conductivity (b) computed from ANSK model (black solid line) and model 1 (red dashed line) for $\theta = 0.75$.

Figure 9

Figure 9. Comparison of density and temperature from the ANSK model (black solid line), EV-DSMC (black diamonds) and model 1 (red dashed line) for three non-evaporative heat transfer cases. Rows: (a,b) $L=200$, $\theta _l=0.65$, $\theta _v=0.70$, $\alpha = 2.4$, $q_{c} = -1.90 \times 10^{-4}$; (c,d) $L=120$, $\theta _l=0.60$, $\theta _v=0.64$, $\alpha = 1.83$, $q_{c} = -1.55 \times 10^{-4}$; (e,f) $L=220$, $\theta _l=0.52$, $\theta _v=0.60$, $\alpha = 0.69$, $q_{c} = -1.99 \times 10^{-4}$; with $L_0=40$, $J=0$.

Figure 10

Figure 10. (a) Comparison of density and (b) temperature profiles from the ANSK model (black solid line), model 1 (red dashed line) and MD simulations (black stars) for non-evaporative heat transfer case. Here, $\theta _l=0.5348$, $\alpha = 0.52$ and $q_{c} = -2.55 \times 10^{-4}$.

Figure 11

Figure 11. Density and temperature profiles with forced evaporation, comparing the ANSK model, EV-DSMC, model 1 and model 2. (a–b) $L = 200$, $\theta _l = 0.60$, $\theta _v = 0.56$, $J = 0.000745$, $\alpha = 1.26$. (c–d) $L = 220$, $\theta _l = 0.52$, $\theta _v = 0.48$, $J = 0.00035$, $\alpha = 0.31$. Interface at $L_0 = 60$.

Figure 12

Figure 12. Temperature jump across the interface, defined as $ \theta _l - \theta _v$, plotted as a function of the Mach number.