Transmission electron microscopy (TEM) and associated techniques are essential tools for materials science students and professionals. Modern TEM has become more capable and reveals a lot of information. However, the interpretation demands knowledge of the interaction between electrons and materials, which is the focus of this book. This book was developed based on the authors’ previous classic book, Electron Microdiffraction (Plenum, New York, 1992), with some extension to reflect recent progress in TEM.
The book starts with a brief introduction to the fundamentals of matter–electron interactions and historical development of TEM and electron diffraction, particularly microbeam diffraction. Chapter 2 explains the electron wave and its propagation and lays the theoretical foundation for the following chapters. Chapter 3 elucidates diffraction geometry of crystalline materials. The more theoretical aspects of electron diffraction and the kinematical and dynamic theories are introduced in chapters 4 and 5. Chapters 6–9 describe the electron optics and the instrument, including lens design (chapter 6), lens aberration and correction (chapter 7), and electron sources and detectors (chapters 8 and 9). Chapter 10 covers the experimental techniques, but these techniques are still more theoretical, so this chapter is by no means an operations manual. However, it is rewarding to understand the fundamental principles behind each step of alignment. Crystallography is covered in chapters 11 and 12; chapter 11 includes symmetry of crystals, while crystal structures and their atomic bonding are elucidated in chapter 12. The impact of temperature and the imperfection of crystals on diffraction, as well as diffuse scattering, is discussed in chapter 13. Chapter 14 explains atomic resolution imaging, both high-resolution TEM and scanning transmission electron microscopy.
Although most of the first 14 chapters lay a solid foundation for electron microscopy and the interaction between electrons and matter, chapters 15–17 are more practical and vital for researchers working on microstructure characterization of materials. These chapters explain the theory and experimental techniques in defect analysis (chapter 15), strain measurement (chapter 16), and nanomaterials study (chapter 17). They are also good references for researchers in these fields, as very recent progress is also reviewed. The appendices are useful for data analysis.
This book is more about imaging and diffraction; although the knowledge covered makes it easier to understand energy-dispersive spectroscopy and electron energy-loss spectroscopy, these topics are not included. In comparison with other books on TEM, this one is written at a more advanced level and is targeted at materials science or physics graduate students. The content leans more on the theoretical than the experimental aspects of TEM. This book would be a good choice for students or researchers who have some knowledge and experience and are seeking a better understanding of TEM or are planning in-depth microstructural analysis work. However, as a textbook, there is a lack of worked examples and homework problems. All figures and tables are helpful for the readers to understand the associated topics. The book is largely self-contained, but previous exposure to quantum mechanics and related mathematics is highly desired.
Reviewer: Wanfeng Li, research engineer of Research & Advanced Engineering, Ford Motor Company, USA.
