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Understanding materials microstructure and behavior at the mesoscale

Published online by Cambridge University Press:  09 November 2015

A.D. Rollett
Affiliation:
Department of Materials Science and Engineering, Carnegie Mellon University, USA; rollett@andrew.cmu.edu
G.S. Rohrer
Affiliation:
Department of Materials Science and Engineering, Carnegie Mellon University, USA; gr20@andrew.cmu.edu
R.M. Suter
Affiliation:
Department of Physics, Carnegie Mellon University, USA; suter@andrew.cmu.edu

Abstract

Taking the mesoscale to mean length and time scales at which a material’s behavior is too complex to be understood by construction from the atomistic scale, we focus on three-dimensional characterization and modeling of mesoscale responses of polycrystals to thermal and mechanical loading. Both elastic and plastic internal structural responses are now accessible via high-energy x-ray probes. The combination of diffraction experiments and computed tomography, for example, is yielding new insights into how void formation correlates with microstructural features such as grain boundaries and higher-order junctions. The resulting large, combined data sets allow for validation of micromechanical and thermal simulations. As detectors improve in resolution, quantum efficiency, and speed of readout, data rates and data volumes present computational challenges. Spatial resolutions approach one micrometer, while data sets span a cubic millimeter. Examples are given of applications to tensile deformation of copper, grain growth in nickel and titanium, and fatigue cracks in superalloys.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2015 
Figure 0

Figure 1. Diagram contrasting the more typical reductionist approach in science with the mesoscale science that results when the behavior at larger time and length scales cannot be constructed starting from the atomistic scale. This diagram has been adapted to illustrate the point that many aspects of the mechanical behavior of polycrystalline materials are strongly microstructure-dependent, and in many cases, cannot be computed from the properties of the underlying defects such as dislocations and point defects. Note: Bold text signifies properties, features, or defects that are relevant to this article. Courtesy G. Crabtree.

Figure 1

Table I. Mechanical properties and their accessibility.

Figure 2

Figure 2. (a) An image of the (left) copper tensile sample and (right) a tomographic image of the waisted gauge section that was tracked with near-field high-energy diffraction microscopy (nf-HEDM) and computed tomography as the specimen necked. The initial diameter of the gauge section was 1 mm. (b) Voxel-based lattice orientation maps from nf-HEDM of a selected cross section show how individual grains are tracked between successive strain steps (0%, 6%, and 12%); grains 2 and 15 are marked. (c) Voxels in a set of 10 large grains tracked in an inverse pole figure; the exploded views emphasize how initial orientations (blue) expand into clouds of orientations as strain increases (red, green, purple). The thin black arrows indicate the change in the average orientation of each grain. Grain 2 spreads rather uniformly, whereas grain 15 appears to bifurcate into two orientation regions. (d) Orientation variations within grains averaged over the 150 largest tracked grains: KAMave is the globally averaged grain average of the local kernel average misorientation; IGMave is the average of the misorientation of each point from the average orientation of the associated grain.7,23 Vertical bars are standard deviations across 150 grains. Note: θave, average value at each strain step of either the KAM or IGM.

Figure 3

Figure 3. Illustration of the value of multimodal imaging. (a) The thin-sheet sample of the nickel-based superalloy was subjected to tensile fatigue. (b) Replicas supplemented by scanning electron microscope (SEM) identified surface cracks. (c) Orientation scanning (electron backscatter diffraction [EBSD]) in the SEM mapped out the area around the surface crack in detail after the sample had been measured with a near-field high-energy diffraction microscope (nf-HEDM) in (d) three dimensions (around the same crack), approximately 600 µm × 800 µm × 240 µm. False colors are mapped from the Rodrigues vector components specifying the orientation at each point. (e) The three-dimensional (3D) measurement permits the micromechanical fields around the crack to be calculated.9