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Irradiation damage of single crystal, coarse-grained, and nanograined copper under helium bombardment at 450 °C

Published online by Cambridge University Press:  22 October 2013

Weizhong Han*
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
E.G. Fu
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
Michael J. Demkowicz
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Yongqiang Wang
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
Amit Misra
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
*
a)Address all correspondence to this author. e-mail: weizhong@lanl.gov

Abstract

The irradiation damage behaviors of single crystal (SC), coarse-grained (CG), and nanograined (NG) copper (Cu) films were investigated under Helium (He) ion implantation at 450 °C with different ion fluences. In irradiated SC films, plenty of cavities are nucleated, and some of them preferentially formed on growth defects or dislocation lines. In the irradiated CG Cu, cavities formed both in grain interior and along grain boundaries; obvious void-denuded zones can be identified near grain boundaries. In contrast, irradiation-induced cavities in NG Cu were observed mainly gathering along grain boundaries with much less cavities in the grain interiors. The grains in irradiated NG Cu are significantly coarsened. The number density and average radius of cavities in NG Cu was smaller than that in irradiated SC Cu and CG Cu. These experiments indicate that grain boundaries are efficient sinks for irradiation-induced vacancies and highlight the important role of reducing grain size in suppressing radiation-induced void swelling.

Information

Type
Invited Feature Papers
Copyright
Copyright © Materials Research Society 2013 
Figure 0

FIG. 1. SRIM calculation of (a) He concentration and (b) damage profile for 2 × 1016, 1 × 1017, and 2 × 1017 ions/cm2 fluences of 200 keV He irradiation on the 100-nm Cu foil and bulk Cu sample. Gray areas in the figures represent the TEM foils. The insets are the detailed calculation of the He concentration and damage for the 100-nm-thick Cu foil.

Figure 1

FIG. 2. TEM images showing the SC Cu film (a) prior to irradiation and after fluences of (b) 2 × 1016 ions/cm2, (c) 1 × 1017 ions/cm2, and (d) 2 × 1017 ions/cm2. The image in (a) is in focus, whereas those in (b)–(d) are taken under a defocus of −3 μm.

Figure 2

FIG. 3. Irradiation damage near grain boundary I in CG Cu under fluences of (a) 2 × 1016 ions/cm2 and (b) 1 × 1017 ions/cm2. Irradiation damage near grain boundary II in CG Cu under fluences of (c) 2 × 1016 ions/cm2 and (d) 2 × 1017 ions/cm2. All images were taken with a defocus of −5 μm. VDZ stands for “void-denuded zone.” The dashed ellipse in (d) shows cavities that were not present at the lower dose shown in (c).

Figure 3

FIG. 4. (a) Dark-field TEM image and (b) grain size distribution of as-deposited NG Cu. (b) Dark-field TEM image of NG Cu after irradiation at 450 °C to a fluence of 1 × 1017 ions/cm2. (d) Grain size distribution of irradiated NG Cu in (c).

Figure 4

FIG. 5. NG Cu irradiated to fluences of (a) 2 × 1017 ions/cm2, (b) 1 × 1017 ions/cm2, and (c) 2 × 1016 ions/cm2. (d) Elliptical cavities formed along grain boundaries in NG Cu irradiated to a dose of 1 × 1017 ions/cm2 (grain boundary contours are marked by white stars). (a)–(c) were taken under a defocus of −2 μm and (d) is in focus.

Figure 5

FIG. 6. Comparison of the dose dependences of (a) the number density of cavities in SC Cu and in grain interiors of CG and NG Cu and (b) the average radius of cavities formed at grain boundaries in CG Cu and NG Cu.