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Effects of minor Cu and Mg additions on microstructure and material properties of 8xxx aluminum conductor alloys

Published online by Cambridge University Press:  08 March 2017

Lei Pan
Affiliation:
Department of Applied Sciences, University of Québec at Chicoutimi, Saguenay, QC G7H 2B1, Canada
Kun Liu
Affiliation:
Department of Applied Sciences, University of Québec at Chicoutimi, Saguenay, QC G7H 2B1, Canada
Francis Breton
Affiliation:
Arvida Research and Development Centre, Rio Tinto, Saguenay, QC, G7S 4K8, Canada
X-Grant Chen*
Affiliation:
Department of Applied Sciences, University of Québec at Chicoutimi, Saguenay, QC G7H 2B1, Canada
*
a) Address all correspondence to this author. e-mail: xgrant_chen@uqac.ca

Abstract

The effects of minor Cu (0–0.29 wt%) and Mg (0–0.1 wt%) additions on the microstructure, electrical conductivity, mechanical, and creep properties of 8xxx aluminum conductor alloys were studied. The microstructure evolution was investigated using an optical microscope and the electron backscattered diffraction technique. The creep property was characterized by the primary creep strain and the minimum creep rate during creep deformation. The results demonstrated that additions of minor Cu and Mg reasonably improved the ultimate tensile strength but slightly reduced electrical conductivity. The addition of Cu remarkably decreased the primary creep strain but had a negligible effect on the minimum creep rate, leading to a beneficial effect on the short-term creep resistance but no advantage to the creep resistance under the long-term creep process. The minor addition of Mg greatly reduces both the primary creep strain and minimum creep rate, resulting in a significant and effective improvement in the creep resistance.

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Copyright
Copyright © Materials Research Society 2017 
Figure 0

TABLE I. Chemical compositions of the experimental alloys (wt%).

Figure 1

FIG. 1. Optical micrographs showing the particles distribution of the alloys: (a) Al–0.3Fe, (b) Al–0.3Fe–0.29Cu, (c) Al–0.7Fe, and (d) Al–0.7Fe–0.18Cu–0.1Mg, showing fine Fe-containing intermetallic particles distributed along the extrusion direction (ED).

Figure 2

FIG. 2. Orientation image mapping showing the extruded microstructure of the alloys: (a) Al–0.3Fe, (b) Al–0.3Fe–0.29Cu, (c) Al–0.7Fe, (d) Al–0.7Fe–0.18Cu–0.1Mg, and (e) inversed pole figure coloring and ED. Boundary misorientation indicated as follows: white lines 1–5°, blue lines: 5–15°, thin black lines: 15–30°, and thick black lines >30°.

Figure 3

FIG. 3. The evolution of subgrain size with an increase of (a) Cu and (b) Mg contents.

Figure 4

FIG. 4. Influence of alloying elements on electrical conductivity: (a) Cu and (b) Mg.

Figure 5

FIG. 5. Correlation between calculated and experimentally measured EC.

Figure 6

FIG. 6. Influence of individual alloying elements on UTS: (a) Cu, (b) Mg, and (c) Fe with a linear relationship.

Figure 7

FIG. 7. Correlation between calculated and experimentally measured UTS.

Figure 8

FIG. 8. EC and UTS profile of the alloys with different Cu and Mg additions. Arrows show the increasing Cu and Mg additions to their corresponding regions.

Figure 9

FIG. 9. Typical compressive creep curves of Al–0.3Fe alloys with different Cu contents, tested at 100 °C and applied load of 69 MPa: (a) creep strain (ε) and (b) instantaneous creep rate ($\dot \varepsilon$).

Figure 10

FIG. 10. Evolution of the primary creep strain (εp) (a) and minimum creep rate (${\dot \varepsilon _{\rm{m}}}$) (b) as a function of Cu content.

Figure 11

FIG. 11. Typical compressive creep curves of Al–0.3Fe–0.18Cu alloys with different Mg contents, tested at 100 °C and applied load of 69 MPa: (a) creep strain (ε) and (b) instantaneous creep rate ($\dot \varepsilon$).

Figure 12

FIG. 12. Evolution of the primary creep strain (εp) (a) and minimum creep rate (${\dot \varepsilon _{\rm{m}}}$) (b) as a function of Mg content.