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Assessing texture development and mechanical response in microscale reverse extrusion of copper

Published online by Cambridge University Press:  15 February 2018

Bin Zhang
Affiliation:
Mechanical & Industrial Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
Yooseob Song
Affiliation:
Civil and Environmental Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
George Z. Voyiadjis
Affiliation:
Civil and Environmental Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
Wen Jin Meng*
Affiliation:
Mechanical & Industrial Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
*
a)Address all correspondence to this author. e-mail: wmeng1@lsu.edu

Abstract

Axisymmetric reverse extrusion experiments were conducted on annealed Cu rod specimens to form cup-shaped structures with sidewall thicknesses ranging from ∼400 µm down to ∼25 µm. Changes in Cu grain morphology, size, and texture were examined through scanning electron microscopy and electron backscatter diffraction (EBSD). Pole figure and orientation distribution function analysis of EBSD data showed the same texture components in the present small-scale metal forming experiments as those observed in macroscale sheet metal rolling. The plastic deformation became inhomogeneous as the characteristic dimension for extrusion decreased to ∼25 µm, such that the deformation process involved a small number of Cu grains. Extrusion force–punch displacement curves were measured as a function of extruded cup sidewall thickness and compared to outputs of a continuum plasticity finite element analysis in corresponding geometries. The present work illustrates materials characteristics in small-scale metal forming and suggests directions of future work for bringing improved correspondence between experimentation and modeling.

Information

Type
Article
Copyright
Copyright © Materials Research Society 2018 
Figure 0

FIG. 1. SEM images of cup-shaped Cu specimens obtained from reverse extrusion: (a) transverse cross-section of a cup-shaped specimen with a sidewall thickness of ∼400 µm, extruded with a 2.2 mm diameter punch; (b) longitudinal cross-section of the specimen shown in (a); (c) longitudinal cross-section of a cup-shaped specimen with a sidewall thickness of ∼100 µm, extruded with a 2.8 mm diameter punch; (d) longitudinal cross-section of a cup-shaped specimen with a sidewall thickness of ∼25 µm, extruded with a 2.95 mm diameter punch. The substance exhibiting varying contrasts in the images is the epoxy used to encapsulate the specimens prior to mechanical polishing.

Figure 1

FIG. 2. EBSD orientation maps of as-annealed and extruded Cu specimens: (a) a typical as-annealed Cu specimen; (b) a polished longitudinal cross-sectional surface on which orientation maps were obtained at different locations; (c)–(f) show, respectively, orientation maps at locations A, B, C, and D marked in (b); (g) measured hardness values along the extruded cup sidewall, from location A to D shown in (b).

Figure 2

FIG. 3. EBSD examination of the grain deformation and texture development due to reverse extrusion: (a) a longitudinal cross-sectional SEM image of an extruded cup sidewall with a thickness of ∼100 µm; (b) an orientation map obtained from area 1 marked in (a); (c) an orientation map obtained from area 2 marked in (a); (d) (001), (110), and (111) PFs obtained from EBSD data collected from area 2 in (a); (e) the corresponding ODF. The locations of copper, brass, S, and goss components in the Euler angle space are identified by symbols.

Figure 3

FIG. 4. EBSD examination of the grain deformation and texture development due to reverse extrusion: (a) a longitudinal cross-sectional SEM image of an extruded cup sidewall with a thickness of ∼25 µm. The entire EBSD mapping area is outlined with the white rectangular box; (b) the EBSD orientation map of the rectangular mapping area shown in (a). The black arrow shows the location and direction for the misorientation angle measurement shown in (c); (c) a plot of the point-to-point misorientation angle along the path outlined by the black arrow in (b); (d) (001), (110), and (111) PFs obtained from EBSD data shown in (b); (e) the corresponding ODF. Locations of the copper, S, brass, and goss components in the Euler angle space are identified by symbols.

Figure 4

FIG. 5. EBSD examination of grain deformation underneath the punch: (a) a longitudinal cross-sectional EBSD orientation map of the region immediately underneath the punch. The black dashed line is a guide to the eye for delineating the boundaries between Cu regions with different degrees of deformation; (b) the longitudinal cross-sectional SEM image of the specimen from which the EBSD orientation map of (a) is taken, together with the orientation map (to scale and at location).

Figure 5

FIG. 6. SEM images of extruded cup-shaped Cu specimens obtained at a 45 tilt angle: a typical image of extruded cup with sidewall thickness of (a) ∼100 µm; (b) ∼25 µm.

Figure 6

FIG. 7. Measured and simulated mechanical response of axisymmetric reverse extrusion: (a) a set of experimental P–d curves obtained with punches of varying diameters; (b) a set of FEA output P–d curves obtained with punches of varying diameters and a constant friction coefficient of 0.02.

Figure 7

FIG. 8. Comparing FEA output with experimental reverse extrusion response curves: experimental P–d curves plotted together with FEA output with different values of friction coefficient for the case of (a) 2.20 mm diameter punch; (b) 2.60 mm diameter punch; (c) 2.95 mm diameter punch.

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