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Defect structure evolution and abnormal grain growth during spark plasma sintering of nano WC–Si powders

Published online by Cambridge University Press:  12 April 2016

A.K. Nanda Kumar*
Affiliation:
Functional Materials Division, CSIR-CECRI, Karaikudi 630 003, India
B. Subramanian
Affiliation:
Functional Materials Division, CSIR-CECRI, Karaikudi 630 003, India
Kazuya Kurokawa
Affiliation:
National Institute of Technology, Tomakomai College, Nishikioka, Tomakomai 059 1275, Japan
*
a)Address all correspondence to this author. e-mail: aknk27@yahoo.com

Abstract

The microstructural evolution during spark plasma sintering of ultrafine WC–1 wt% Si (n-WC–Si) is presented. At 1323 K (T < TmSi), extensive stacking faults on the $\left\{ {10\bar 10} \right\}$ prismatic planes are observed. The defect microstructure can be described as a combined shear of $1/6\left\langle {\bar 12\bar 13} \right\rangle$ on the prism planes and simultaneous out-diffusion of carbon through the faults to the interparticle boundaries. At temperatures near TmSi (1673 K), a large fraction of abnormally grown platelets is observed. These platelets contain a single planar defect on their basal planes, described by a ${1 \mathord{\left/ {\vphantom {1 3}} \right. \kern-\nulldelimiterspace} 3}\left\langle {10\bar 10} \right\rangle$ translation of the carbon atoms across a Σ1 grain boundary (GB). Three factors contribute to the abnormally high density of platelets: (i) the low-temperature prismatic dislocations interact to form facet-roughening steps/kinks that act as nucleation sites, (ii) a liquid phase triggers an increased growth rate in the vicinity of the Si inclusions, and (c) the basal twin produces a re-entrant edge for 2D nucleation.

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Articles
Copyright
Copyright © Materials Research Society 2016 
Figure 0

FIG. 1. Microstructures of ultrafine WC–Si samples sintered at (a) 1323 K showing a Si particle in the nano grained WC matrix; (b) 1673 K showing clusters and abnormally grown grains with clear crystal facets, and (c) 1673 K sintered specimen showing an abnormal grain with pores arranged along the line of contact of two basal planes. All distance markers represent 1 μm.

Figure 1

FIG. 2. Coarsening rate of small grains and platelets at 1673 K.

Figure 2

FIG. 3. (Top) (a) BF and SAD pattern of the sample sintered at 1323 K for 30 min obtained with the zone axis close to [0001]; (Bottom) a, b, and c are the centered DF images from the spots marked in the SAD pattern above.

Figure 3

FIG. 4. (a) Diffraction from a multiply twinned grain showing matrix (M) and twin (T) reflections as faint spots; (b) SAD pattern from a grain oriented with the incident beam nearly parallel to [0001], showing strong streaking along $\left\langle {10\bar 10} \right\rangle$. The arrows point to reflection spots in the streaks midway between the primary reflections. These are signatures of the ‘O’ phase.

Figure 4

FIG. 5. TEM micrograph of specimen sintered at 1323 K for 60 min.

Figure 5

FIG. 6. BF from the sample sintered at 1323 K, showing a pair of heavily faulted grains. The carbon pocket and pore are marked. The uniform gray contrast appearing at the periphery of the particles to ∼10 nm is an amorphous re-deposit and is an artifact of the milling process. The carbon-rich pocket is distinguished by its uniform gray contrast. The XEDS spectra acquired by cutting down the beam to a 1 nm probe from the regions marked as A, B, and C in the BF are also shown. Note the intensity of the C line relative to W from the amorphous pocket; a trace amount of Si is also expected in this area, since the Si and W lines are within 40 eV of each other.

Figure 6

FIG. 7. (a) BF of a platelet from the specimen sintered at 1673 K. The inset shows the SAD obtained from $\approx \left[ {11\overline 2 0} \right]$ zone axis. WSi2 forms on the basal plane of the abnormal grain; (b) BF of a cluster of faceted grains from the same specimen.

Figure 7

FIG. 8. (a) GB map showing the WC grains and both HA (red) and LA (green lines) GBs (LA GBs are marked by yellow arrows) and (b) IPF map from the same area.

Figure 8

FIG. 9. Distribution of the misorientation angles of the sample sintered at 1673 K. The 90° rotation clusters around $\left\{ {10\bar 10} \right\}$, indicating a Σ2 GB.

Figure 9

FIG. 10. Microstructures of WC–Si specimens held isothermally at (a) 1323 K for 30 min and then ramped up to 1673 K showing AGG localized to the vicinity of the Si inclusion and (b) 1323 K for 60 min and then ramped up to 1673 K also showing AGG localized only to the vicinity of the Si inclusion. Distance markers represent 10 μm.

Figure 10

FIG. 11. (a) BF image of a region with multiple intersecting faults and (b) a grain with SFs on two prismatic planes intersecting to form a dislocation step (circled area).

Figure 11

FIG. 12. (a) Schematic of SFs bound by partial dislocations on two adjacent prismatic planes with burger's vector (b1–b4) marked and (b) creation of a kink/step after passage of the partials. The step moves along with the partials, finally ending as a ledge on the prism facet surface.

Figure 12

FIG. 13. (a) A FE-SEM image of a grain that was etched from a high-temperature sintered WC–Si specimen, showing the hexagonal morphology; (b) a higher magnification view of the boxed area in (a) showing linear etch patterns on the prismatic planes; (c) a closer look at the etch patterns showing discontinuous, but straight etch lines and also lines that seem to slip from one prismatic plane to another, and (d) a cross-sectional view of a platelet that shows approximately three layers stacked along the basal plane. All distance markers represent 10 μm.

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