Hostname: page-component-74656f9884-c52kr Total loading time: 0 Render date: 2026-11-08T00:54:07.060Z Has data issue: false hasContentIssue false

Effect of graphitic filler size and shape on the microstructure, electrical percolation behavior and thermal properties of nanostructured multilayered carbon films deposited onto paper substrates

Published online by Cambridge University Press:  05 December 2013

Rachel L. Muhlbauer
Affiliation:
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332-0245
Timothy L. Pruyn
Affiliation:
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332-0245
Waylon T. Puckett
Affiliation:
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332-0245
Rosario A. Gerhardt*
Affiliation:
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332-0245
*
a) Address all correspondence to this author. e-mail: rosario.gerhardt@mse.gatech.edu

Abstract

Dispersions containing 1 mg/mL of several carbon nanomaterials were used to deposit films containing 1 to 20 layers. The electrical properties of the composite films were characterized via impedance spectroscopy along two directions: in-plane on the film topmost surface and also through the thickness. It was found that carbon black nanoparticles never achieved full in-plane interconnection while the multiwalled carbon nanotube (MWNT) and single-walled carbon nanotube were already percolated at one layer. Graphite flakes showed a complete percolation curve that allowed its resistance to change by 6–7 orders of magnitude. The differences in the microstructure, electrical response, and thermal decomposition behavior of these carbon nanomaterial–paper substrate films were explained by detailed equivalent circuit analysis of the impedance spectra. Interpretation was supplemented by scanning electron microscopy images and thermal analysis via Differential Scanning Calorimetry/Thermogravimetric Analysis (DSC/TGA). Thru-plane electrical properties were for the most part similar, although only films with short MWNT showed a clearly infiltrated network structure.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2013 
Figure 0

FIG. 1. SEM micrographs of the composite surfaces for CB (1a and 1b), MWNT (1c and 1d), graphite (1e and 1f), and SWNT (1g and 1h) and paper composites. Images on the left are for 4-layered films, whereas those on the right are for 20-layered samples. The scale bar reads 2 µm.

Figure 1

FIG. 2. Comparison of the low frequency AC resistance for all nanomaterial–paper composite films fabricated and measured.

Figure 2

FIG. 3. CB and paper composite impedance curves for the in-plane behavior of (a) 1 deposited layer and (b) 4–20 deposited layers of CB. (c) The impedance curves of the thru-plane for 1–20 deposited layers of CB. The equivalent circuit used to fit the impedance spectra is available within each figure. (d) A low-magnification SEM image of the surface of the film with 20-CB-deposited layers. Magnification marker = 5 μm.

Figure 3

FIG. 4. MWNT and paper composite impedance curves for the in-plane behavior of (a) 1 and 4 deposited layers and (b) 8–20 deposited layers. (c) The thru-plane impedance behavior for the MWNT and paper materials. The equivalent circuit used to fit the impedance spectra is available within each figure. (d) A low-magnification SEM image of the surface of the film with 20-MWNT-deposited layers. Magnification marker = 5 μm.

Figure 4

FIG. 5. Graphite and paper composite impedance curves for the in-plane behavior of (a) 1 and 4 deposited layers; (b) 8 and 12 deposited layers; and (c) 16 and 20 deposited layers of graphite. (d) The impedance behavior for the thru-plane for the 1–20 deposited layers of graphite. The equivalent circuit used to fit the impedance spectra is available within each figure.

Figure 5

FIG. 6. SWNT and paper composite impedance curves for the in-plane behavior of (a) 1 deposited layer and (b) 4–20 deposited layers of SWNTs. (c) The impedance behavior of the thru-plane measurements for 1–20 deposited layers of SWNTs. The equivalent circuit used to fit the impedance spectra is available within each figure. (d) A low-magnification SEM image of the surface of the film with 20-SWNT-deposited layers. Magnification marker = 5 μm.

Figure 6

TABLE I. Equivalent circuit values for the circuit in Fig. 3(b) corresponding to 4–20 deposited layers of CB for impedance behavior measured on the composite surface.

Figure 7

TABLE II. Equivalent circuit values for the circuit in Figs. 3(c) and 6(c) corresponding to the thru-plane impedance behavior for 1–20 deposited layers of CB and SWNTs on paper.

Figure 8

TABLE III. Values for the nested-RL circuit describing the in-plane impedance response for the curves in Fig. 4(a) (MWNT: 1 and 4 layers) and Fig. 6(a) (SWNT: 1 layer).

Figure 9

TABLE IV. Equivalent circuit values for the circuit in Fig. 5(b), describing the in-plane thin film behavior of graphite deposited on paper.

Figure 10

FIG. 7. Schematics representing the microstructural details of the composite films fabricated and measured. (a) Schematic representation of the structure occurring for CB and graphite flakes. (b) The microstructure of the MWNT composite films. SWNT composite films are not shown but are described in the text.

Figure 11

FIG. 8. Representative TGA/DSC curve for the CB-paper specimens with 20 layers. Thermal decomposition processes are labeled as peak 1, 2, and 3.

Figure 12

TABLE V. Temperature at the peak position of the heat flow versus temperature graphs for the different pure materials corresponding to the end of a weight loss event.

Figure 13

FIG. 9. Peak temperature versus number of layers of carbon nanomaterial deposited on each composite film set: (a) paper weight loss peak; (b) the carbon material/paper/surfactant interface or SWNT powder weight loss peak; and (c) the powder weight loss peak. The leftover powder weight loss peak only appears when there is enough powder not associated with the paper backbone leftover during the thermal cycle.