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Creep, fatigue, and fracture behavior of high-entropy alloys

Published online by Cambridge University Press:  10 July 2018

Weidong Li*
Affiliation:
Department of Materials Science and Engineering, The University of Tennessee, Knoxville, Tennessee 37996, USA
Gang Wang
Affiliation:
Laboratory for Microstructures, Institute of Materials, Shanghai University, Shanghai 200444, China
Shiwei Wu
Affiliation:
Laboratory for Microstructures, Institute of Materials, Shanghai University, Shanghai 200444, China
Peter K. Liaw*
Affiliation:
Department of Materials Science and Engineering, The University of Tennessee, Knoxville, Tennessee 37996, USA
*
a)Address all correspondence to these authors. e-mail: lei432378yu@gmail.com
b)e-mail: pliaw@utk.edu

Abstract

As high-entropy alloys (HEAs) are being actively explored for next-generation structural materials, gaining a comprehensive understanding of their creep, fatigue, and fracture behaviors is indispensable. These three aspects of mechanical properties are particularly important because (i) creep resistance dictates an alloy’s high-temperature applications; (ii) fatigue failure is the most frequently encountered failure mode in the service life of a material; (iii) fracture is the very last step that a material loses its load-carrying capability. In consideration of their importance in designing HEAs toward applicable structural materials, this article offers a comprehensive review on what has been accomplished so far in these three topics. The sub-topics covered include a comparison of different creep testing methods, creep-parameter extraction, creep mechanism, high-cycle fatigue S–N relation, fatigue-crack-growth behavior, fracture toughness, fracture under different loading conditions, and fractography. Directions for future efforts are suggested in the end.

Information

Type
Invited Review
Copyright
Copyright © Materials Research Society 2018 
Figure 0

FIG. 1. Uniaxial-stress relaxation curves of the (a) fcc Al0.15CoCrFeNi and (b) fcc + bcc Al0.6CoCrFeNi HEAs at varied temperatures. (c) Measured data in the form of $\ln \left( {{{\dot{\varepsilon }}_{\rm{c}}}\exp \left( {{Q / {RT}}} \right)} \right)$ versus ln σ (symbols) for the two HEAs collected from different testing temperatures along with the best linear fitting lines from which unique values of Q and n were determined for each alloy. (d) The measured data in the form of $RT\ln {\dot{\varepsilon }_{\rm{c}}}$ versus σ (symbols) for the Al0.6CoCrFeNi HEAs collected from different testing temperatures along with the best linear-fitting lines from which the activation volume, V*, was determined.29

Figure 1

FIG. 2. (a) Creep tests conducted in the elastic regime of the nanocrystalline (nc) and coarse-grained (cg) CoCrFeMnNi HEAs with a fcc phase at room temperature by spherical nanoindentation. (b) Uniaxial creep-strain rate (converted from the indentation creep-strain rate), $\dot{\varepsilon }_{\rm{u}}^{{\rm{creep}}}$, as a function of the holding time for the nanocrystalline HEAs with a grain size of ∼33 nm at different load levels, with the inset showing the indentation creep strain, $\varepsilon _{\rm{i}}^{{\rm{creep}}}$, as a function of the holding time. (c) Measured creep data in the form of $\ln {\dot{\varepsilon }_{{\rm{ssc}}}}$ versus ln σ (symbols) along with the best linear-fitting lines from which the stress exponent, n, was determined. (d) Measured creep data in the form of $\ln {\dot{\varepsilon }_{{\rm{ssc}}}}$ versus σ (symbols) along with the best linear-fitting lines from which the activation volume, V*, were determined.33

Figure 2

FIG. 3. Creep tests conducted on the fcc Al0.3CoCrFeNi HEAs by Berkovich nanoindentation at (a) different maximum loads and (c) loading rates. Variation of the stress exponent and hardness with (b) the applied loads and (d) loading time.31

Figure 3

TABLE I. The derived stress exponent, n, and activation volume, V*, of HEAs from different creep tests.

Figure 4

FIG. 4. Fatigue S–N data of the (a) as-cast20 and (b) wrought21 Al0.5CoCrCuFeNi HEAs with a dual fcc structure. The curves in (a) are the predicted quantile lives with the Weibull mixture predictive model20 while those in (b) are the predicted stress amplitude versus median fatigue life by the random endurance-limit model.21 (c) Effect of defects counts on the fatigue life of the as-cast Al0.5CoCrCuFeNi HEA at various stress levels.20 (d) Two microstructural morphologies observed by SEM in the as-cast Al0.5CoCrCuFeNi HEA. Left: a lamellar flow pattern with alternating α (dark) and β (light) phases. Right: a random orientation of α and β phases.20

Figure 5

FIG. 5. Fatigue data of the wrought Al0.5CoCrCuFeNi HEAs in comparison with conventional alloys and BMGs. (a) Stress amplitude versus cycles to failure. (b) Fatigue ratio versus cycles to failure. (c) Fatigue-endurance limit versus ultimate tensile strength. (d) Fatigue ratio versus ultimate tensile strength.21

Figure 6

TABLE II. Fatigue strength and fatigue ratio of the HEAs in comparison with some conventional alloys.

Figure 7

FIG. 6. The fatigue-crack-growth behavior of the CrMnFeCoNi, AlCrFeNi2Cu, and Al0.2CrFeNiTi HEAs in comparison with some other advanced materials.

Figure 8

TABLE III. Fatigue-crack-growth properties and testing conditions of the HEAs in comparison with selected conventional alloys.

Figure 9

FIG. 7. SEM graphs of the fracture surfaces of a Condition-3 Al0.5CoCrCuFeNi HEA, failed at 97,715 fatigue cycles at a stress amplitude of 495 MPa, room temperature, and a load ratio of R = 0.1, showing the (a) overview, (b) crack-initiation region, (c) crack-propagation region, and (d) fast-fracture region.21

Figure 10

FIG. 8. (a) J-integral crack–resistance curves of the fcc CrMnFeCoNi HEAs at 77 K, 200 K, and 293 K, from which the fracture toughness, KJIC, can be determined.13 (b) Evidence of the formation of microvoids from Cr- or Mn-rich particles in the alloy at room temperature, suggesting the ductile failure.13 (c) Left: the EBSD images in the vicinity of the crack tip in the deformed CrMnFeCoNi HEA at 293 K, showing the formation of annealing twins and dislocation-induced grain misorientations. Right: the BSE and EBSD images in the wake of the propagated crack in the deformed alloy at 77 K, showing pronounced cell structures resulting from dislocation activities as well as deformation-induced nanotwins.13 (d) Comparison of the HEAs and other materials in the Ashby map of the fracture toughness versus yield strength.59

Figure 11

FIG. 9. (a) SEM image of the fatigue-fractured surface of the AlCrFeNi2Cu HEA, showing the cleavage failure along with some isolated dimple features.36 (b) Fractograph of the AlCoCrCuFeNi HEA exhibiting cleavage facets and river-like lines.64 (c) Fracture surface of the AlCoCrFeNi HEA sintered by the powder metallurgy at 1273 K.65 (d) Secondary electron image of the fracture surface of the AlCoCrFeNi HEA.66

Figure 12

FIG. 10. Fractographs of the nanocrystalline fcc CoCrFeMnNi HEAs (a) subjected to severe plastic deformation, and continual annealing at (b) 450 °C for 1 h, (c) 450 °C for 15 h, (d) 600 °C for 1 h, (e) 700 °C for 1 h, and (f) 800 °C for 1 h.7

Figure 13

FIG. 11. The fractographs of the fcc CoCrFeNi (a–c), fcc Al0.1CoCrFeNi (d–f), and bcc Al1.5CoCrFeNi (g–i) HEAs failed in Charpy-impact tests at 77 K (a, d, and g), 200 K (b, e, and h), and 298 K (c, f, and i).86