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Surface modification and fabrication of 3D nanostructures by atomic layer deposition

Published online by Cambridge University Press:  18 November 2011

Changdeuck Bae
Affiliation:
Institute of Applied Physics, University of Hamburg, Germany; cdbae@physnet.uni-hamburg.de
Hyunjung Shin
Affiliation:
Kookmin University, Seoul, Korea; hjshin@kmu.kookmin.ac.kr
Kornelius Nielsch
Affiliation:
University of Hamburg, Germany; knielsch@physnet.uni-hamburg.de

Abstract

Atomic layer deposition (ALD) not only presents a direct way to prepare nanomaterials when combined with templates, but also allows surface engineering to fine-tune the properties of the material. Here, we review recent progress in the field of nanostructured materials and devices that have been fabricated by ALD. Various materials, including semiconducting, magnetic, noble metallic, and insulating materials, can be used to form three-dimensional (3D), complex nanostructures with controlled composition and physical properties. We begin this review with ALD nanomaterials that can be prepared from porous templates with a 2D pore arrangement, such as anodic aluminum oxide, and advance toward opal structures with a 3D pore arrangement. We also discuss surface engineering by ALD on existing nanowires/nanotubes, devices, and chemical patterns that has the potential for application in high-performance transistors, sensors, and green energy conversion. Finally, we provide perspectives for future device applications that could arise from ALD nanomaterials.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2011
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Figure 1. (a) A scanning electron micrograph of TiO2 nanotubes produced by the template-directed atomic layer deposition (ALD) process with an AAO membrane, and a schematic illustration showing the experimental processes: from left to right, templates such as porous polycarbonate and alumina, OTS-SAMs by microcontact printing, ALD deposition onto the inner pores, and chemical etching of the templates. Adapted with permission from Reference 16. ©2004, Wiley InterScience. (b) Schematic depiction of the fabrication processes of multiwall metal oxide nanotubes, and a transmission election microscopy image of quadruple-wall anatase TiO2 nanotubes having 7 nm-thick and spaced walls and released after annealing, as an example. Adapted with permission from Reference 20. ©2009, American Chemical Society.

Figure 1

Figure 2. Left: A tube during the magnetization reversal from M0z to –M0z via a vortex mode (M = M0z, where M is the magnetization, M0 is the magnetic moment, and z is the axis). Center: Wall-thickness (tw)-dependent magnetic properties of magnetite (Fe3O4) nanotube arrays possessing an interpore distance of 105 (±10) nm and length of 1000 nm (blue, coercivity Hc//; red, remanence relative to 1 T) for 2.6 (±0.7) ≤ tw ≤ 18.2 (±1.9) nm. Near a 14 nm wall thickness, two distinctive reversal modes are separated. Right: The equivalent situation by means of a transverse reversal mode. Dp, the diameter of pore. Colors were employed to highlight the domain boundary in red. Adapted with permission from Reference 26. ©2008, American Institute of Physics.

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Table I. Negative-template-directed formation of nanotubes by atomic layer deposition.

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Table II. Inverse opal structures prepared by atomic layer deposition.

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Figure 3. Left panel: Template-patterned sacrificial-layer atomic layer deposition (ALD) applied to create a non-close-packed (NCP) inverse opal. The original opal template in (a) is coated with a conformal thin film, resulting in the new template shown in (b). (c) A second ALD infiltration is performed in the remaining air volume. For conformal deposition techniques, maximum opal infiltration is achieved at ca. 86%, leaving small air pockets at the centers of the voids. (d) Removal of the original template creates a lattice of close-packed interconnected air spheres in a multilayered dielectric matrix. (e) A lattice of overlapping air spheres forms by removing the sacrificial buffer layer. Large air channels now connect the air spheres. (f) Backfilling with additional dielectric forms an NCP lattice of separated air spheres, which are connected by small air tubes. Right panel: Scanning electron microscopy images of ion-milled cross-sections showing the three main stages of NCP inverse-opal fabrication. (g) Stage 1: A two-layer infiltrated 450 nm SiO2 opal with a 15 nm sacrificial ZnS layer and 20 nm TiO2 infiltration. (h) Stage 2: The SiO2 spheres and the ZnS layer have been removed from the sample shown in (g), leaving a lattice of overlapping air spheres in a TiO2 backbone. (i) Stage 3: The sample has been backfilled with 20 nm of TiO2, creating an NCP inverse opal. The dotted circles denote the removal of SiO2 spheres. Scale bars correspond to 200 nm. Adapted with permission from Reference 43. ©2006, Wiley InterScience.

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Figure 4. Schematic illustration of top view and cross-sectional view of anodic aluminum oxide (AAO) and opal structures, showing similar porosity but different trajectories (dotted blue line) during diffusion. If we consider the mean free path (λmfp) of precursor molecules to be several micrometers, we can surmise the scattering events for both structures during diffusion in accordance with the geometry inside (see the text for more details). Gray areas indicate solid oxide for both structures; white represents empty spaces; and the dotted yellow line is the section plane for schematic depiction below.

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Figure 5. Conformal heteroepitaxial deposition of Sb2S3 at 90°C onto Sb2Se3 wires. (a) Energy dispersion x-ray (EDX) line scan across a core shell wire (pictured underneath the graph); the vertical axis displays the signal intensities recorded for the elements Se, Sb, and S in purple, black, and green, respectively. (b) High-resolution transmission electron microscopy image of the extremity of a wire, displaying a dark Au particle (a catalyst used for Sb2Se3 nanowalls) and identifying the crystallographic c-axis parallel to the long axis of the wire. Adapted with permission from Reference 58. ©2010, American Chemical Society.

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Table III. Selected examples of atomic layer deposition on nanowires/nanotubes.

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Figure 6. Three-dimensional reconstruction of atomic force microscopy (AFM) topographical images of (a) patterns in octadecyltrichlorosilane self-assembled monolayers 79 ± 7 nm in diameter, and (b) TiO2 nanodots of 85 ± 16 nm in diameter by atomic layer deposition, using the surface patterns as shown in panel (a), when 350 nm diameter silica particles were used. The insets show the corresponding AFM line profiles. Adapted with permission from Reference 62. ©2006, American Chemical Society.

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Figure 7. Schematic illustration of the fabrication of nano-ring arrays by templated atomic layer deposition (ALD) and Ar+ bombardment: (a) the photoresist (PR) and anti-reflection coating (ARC) layers by laser interference lithography; (b) etching of the underlined SiO2 layer by reactive ion etching with CHF3 gas, and deposition of a conformal TiO2 layer on the substrate relief by ALD; (c) removal of the unwanted parts of the TiO2 layer by Ar+ bombardment; (d) removal of the PR and ARC residuals by O2 plasma; and (e) 3D display of panel (d). Scanning electron microscopy images of (f) the cross-section view of the TiO2 layer coated substrate relief and (g) top view of the freestanding TiO2 nano-ring arrays; the enlarged view is shown as an inset. The inner diameter of the rings is ~119 nm, and the thickness is 34 nm. Black, desired substrates; blue, SiO2 layer; green, TiO2 by ALD; pink, PR/ARC stack in panels (a–e).

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Figure 8. The concept of all around gating (AAG) ionic field-effect transistor (IFET) (gray, amorphous silicon; cyan, SiO2; yellow, atomic layer deposition [ALD] dielectric film; purple, ALD metal film). (a) Schematic of nanochannel AAG-IFET. (b) The ionic strength within the nanochannel can be controlled by an electric gate bias (VGATE), when the channel size becomes as small as the Debye screening length (λD). Cross-sectional scanning electron microscopy images of (c) trench, (d) pipe, and (e) core-shell nanochannels. The nanochannels are surrounded by Al2O3 dielectric/Ru metal. Scale bars are (c, d) 250 nm, (e) 100 nm (top), and 250 nm (bottom). Adapted with permission from Reference 80. ©2010, American Chemical Society.