Hostname: page-component-74656f9884-j7cmm Total loading time: 0 Render date: 2026-11-08T14:00:49.526Z Has data issue: false hasContentIssue false

Modeling ion-solid interactions for imaging applications

Published online by Cambridge University Press:  09 April 2014

D.C. Joy
Affiliation:
Department of Biochemistry, Cellular and Molecular Biology Department of Materials Science and Engineering, University of Tennessee; djoy@utk.edu
J.R. Michael
Affiliation:
Sandia National Laboratories; jrmicha@sandia.gov

Abstract

Ion beams are now widely used to thin, shape, or cut materials on the submicrometer scale. This is possible because ions can sputter (i.e., physically remove) material from the target. Ions can also be used to image materials because the incident beam generates ion-induced secondary electrons (iSE). In both cases, the nature of the target material and the choice of the ion employed and its initial energy will determine not only how quickly the beam can thin a specimen, but also the resolution and contrast of the iSE image that is generated. Clearly, there is a need to be able to predict parameters, such as the nature, information content, and spatial resolution of the iSE image. These and other related questions have been investigated using Monte Carlo simulations. We show how the parameters defining quantities, such as depth of penetration and the energy deposited by the incident beam, or the signal yield and resolution of the iSE image, can be predicted using this approach and how these results make it possible to interpret data and optimize operating conditions.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2014 
Figure 0

Figure 1. Example of fitted ion-induced secondary electron yield data for a 10 keV to 1000 keV He+ beam into C. The continuous line shows the computed best fit to two sets of experimental data.7

Figure 1

Figure 2. Predicted variation in ion-induced secondary electron yield for a 35 keV He+ primary beam as a function of incident beam angle for C, Cu, and Au.7

Figure 2

Figure 3. He+ ion-induced secondary electron image of Au islands on C obtained at an operating voltage of 34.9 kV.7 Image courtesy of Carl Zeiss Inc.

Figure 3

Figure 4. A comparison of predicted ion-induced secondary electron (iSE) yields for H+, He+, and Ne+ at 10 keV to 100 keV into Cu demonstrating the change in iSE yield with incident ion type.7

Figure 4

Figure 5. Predicted ion-induced secondary electron (iSE) yields as a function of target atomic number for 30 keV Ga+ ions. Note the lack of a clear monotonic relationship between the iSE yield and the atomic number of the target.7

Figure 5

Figure 6. Images of a plated brass electronic contact. (a) Electron-induced secondary electrons image at 5 keV. (b) Ga+ ion-induced secondary electron image acquired at an operating voltage of 30 kV.

Figure 6

Figure 7. Ga+ ion-induced secondary electron image of a focused ion beam cross-section of Cu plated with Sn acquired at an operating voltage of 30 kV. IMC is an intermetallic compound formed between Sn and Cu.