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Elastic substrates for stretchable devices

Published online by Cambridge University Press:  02 February 2017

Dianpeng Qi
Affiliation:
Innovative Center for Flexible Devices, School of Materials Science and Engineering, Nanyang Technological University, Singapore; dpqi@ntu.edu.sg
Zhiyuan Liu
Affiliation:
Innovative Center for Flexible Devices, School of Materials Science and Engineering, Nanyang Technological University, Singapore; LI0037AN@e.ntu.edu.sg
Wan Ru Leow
Affiliation:
Innovative Center for Flexible Devices, School of Materials Science and Engineering, Nanyang Technological University, Singapore; WLEOW001@e.ntu.edu.sg
Xiaodong Chen
Affiliation:
Innovative Center for Flexible Devices, School of Materials Science and Engineering, Nanyang Technological University, Singapore; chenxd@ntu.edu.sg

Abstract

Stretchable devices, with the capability of retaining their functionalities under stretching, are drawing much attention as a promising solution to address the mechanical mismatch between traditional stiff electronics and soft curvilinear biological systems. Intensive efforts have been made toward the advancement of stretchable devices, such as the development of novel mechanically durable materials, deformable conductors and circuits, novel processing methods, and elastic matrixes for stretchable substrates and system integration. Among these, the elastic substrate constitutes the component that bears the applied strain and thus endows the device with stretchability, rendering its properties crucial to the overall performance of stretchable devices. This article provides a summary of the elastic materials commonly employed as stretchable substrates, as well as reveals fundamental insights into the properties requirements in the selection of stretchable substrates. Important challenges and strategies in the development of elastic matrices for stretchable devices are also discussed.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2017 
Figure 0

Figure 1. Elastic limits of commonly used materials (silver, copper, gold, and silicon) in traditional electronics, human skin,10 and new elastic substrate materials (poly(dimethylsiloxane) [PDMS] and Ecoflex, a platinum-catalyzed silicone).

Figure 1

Figure 2. (a[i]) A schematic of nanomaterials embedded in an elastic substrate. (a[ii]) Cross-sectional scanning electron microscope (SEM) image of a silver nanowire (AgNW)/poly(dimethylsiloxane) (PDMS) layer. Reproduced with permission from Reference 15. © 2012 Wiley. (a[iii]) The composite fiber mat with silver nanoparticles inside and on the surface is highly stretchable and does not lose conductivity at large strains. Reproduced with permission from Reference 16. © 2012 Nature Publishing Group. (b[i]) A schematic of the wrinkles formed on a layer of active material after relaxing the prestrain of the elastic substrate. (b[ii]) SEM image of semiconductor (GaAs) wrinkles. The prestrain used for generating this sample was 60% (the inset shows a SEM image of a bonded region). Reproduced with permission from Reference 19. © 2006 Nature Publishing Group. (b[iii]) Optical microscope image of gold microbelts on a tripod-structured PDMS substrate using stripes of PDMS as an adhesive and supporting layer; the prestrain in the PDMS substrate was 50%. Reproduced with permission from Reference 2. © 2015 Wiley.

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Figure 3. Schematic of different prestretched structures and analysis of the relevant strain distribution by the finite element method, (a) wrinkled structure, (b) suspended structure, and (c) a bending structure (a suspended wrinkle) on tripod-structured poly(dimethylsiloxane) (PDMS). Reproduced with permission from Reference 2. © 2015 Wiley. (d) The peak stress in the wrinkled and bending structures. Reproduced with permission from Reference 2. © 2015 Wiley. (e) Young’s modulus of human skin (green band), elastic substrates (PDMS and Ecoflex), and commonly used materials (silver, copper, gold, and silicon) in traditional electronics (red band).