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Improvement of X-ray stress measurement from a Debye–Scherrer ring by oscillation of the X-ray incident angle

Published online by Cambridge University Press:  12 August 2015

Toshiyuki Miyazaki*
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Yoichi Maruyama
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Yohei Fujimoto
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Toshihiko Sasaki
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
*
a) Author to whom correspondence should be addressed. Electronic mail: trmiyazaki@staff.kanazawa-u.ac.jp

Abstract

A technique to improve the stress measurement from a Debye–Scherrer ring (D–S ring) is reported. In a previous work, the authors reported a technique to calculate stress from the Fourier series of the normal strain of a D–S ring. That technique, similar to the cosα method that came before it, is inaccurate when the grain size of the specimen is relatively large. To cope with this problem, the authors propose using the oscillation of the X-ray incident angle. The present study demonstrates this technique to improve the stress measurement.

Information

Type
Technical Articles
Copyright
Copyright © International Centre for Diffraction Data 2015 
Figure 0

Figure 1. Arrangement of the stress measurement [from Miyazaki and Sasaki (2014)].

Figure 1

Figure 2. Schematic of the X-ray incident angle oscillation.

Figure 2

Figure 3. Micrograph of the specimen (JIS-S40C).

Figure 3

Figure 4. X-ray stress analyzer and the gonio stage.

Figure 4

Figure 5. Examples of measured D–S rings (stress applied ~160 MPa). (a) Without the incident angle oscillation. (b) With ±10° oscillation.

Figure 5

Figure 6. ε(α) from the D–S ring of Figure 5 (solid line) and the plane stress approximation (dashed line).

Figure 6

Figure 7. ε(α) with ±5° incident angle oscillation (solid line) and the plane stress approximation (dashed line) (stress applied ~160 MPa).

Figure 7

Figure 8. ε(α) with ±10° incident angle oscillation (solid line) and the plane stress approximation (dashed line) (stress applied ~160 MPa).

Figure 8

Figure 9. Power spectrum of ε(α) (stress applied ~160 MPa). Without the incident angle oscillation (δ = 0), with ±5° oscillation (δ = 5), and with ±10° oscillation (δ = 10).

Figure 9

Figure 10. Stress applied with a four-point bending test (horizontal axis) and the X-ray measured stress σx without the incident angle oscillation (vertical axis).

Figure 10

Figure 11. Stress applied with a four-point bending test (horizontal axis) and the X-ray measured stress σx with ±10° incident angle oscillation (vertical axis).

Figure 11

Figure 12. Stress applied with a four-point bending test (horizontal axis) and the X-ray measured shear stress τxy. Without the incident angle oscillation (δ = 0) and with ±10° oscillation (δ = 10).

Figure 12

Figure 13. Stress applied with a four-point bending test (horizontal axis) and the X-ray measured stress σy. Without the incident angle oscillation (δ = 0) and with ±10° oscillation (δ = 10).