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Nano-microstructural control of phonon engineering for thermoelectric energy harvesting

Published online by Cambridge University Press:  09 March 2018

Zihang Liu
Affiliation:
Department of Physics, University of Houston, USA; zliu48@central.uh.edu
Jun Mao
Affiliation:
Department of Mechanical Engineering, University of Houston, USA; jmao5@uh.edu
Te-Huan Liu
Affiliation:
Department of Mechanical Engineering, Massachusetts Institute of Technology, USA; thliu@mit.edu
Gang Chen
Affiliation:
Department of Mechanical Engineering, Massachusetts Institute of Technology, USA; gchen2@mit.edu
Zhifeng Ren
Affiliation:
Department of Physics, University of Houston, USA; zren@uh.edu

Abstract

Manipulating the thermal conductivity of solids is important for practical applications. Due to the fact that phonons in thermoelectric materials have longer mean free paths (MFPs) than electrons, strengthening phonon scattering to reduce lattice thermal conductivity (κlat) becomes the most straightforward and effective approach to enhance the thermoelectric figure of merit, ZT, which determines the maximum device efficiency. Phonons have a wide range of MFPs in semiconductors, and different dimensions of lattice defects can be targeted to scatter particular phonons with distinct relaxation times. Designing hierarchical nano-microstructures, spanning from point defects to volume defects, would be beneficial to achieve low κlat via a full spectrum of phonon scattering. Herein, we review the formation and underlying mechanisms for lattice defects and highlight the role of all-scale hierarchical nano-microstructure on phonon engineering. Existing challenges in simulations are also discussed.

Information

Type
Materials for Energy Harvesting
Copyright
Copyright © Materials Research Society 2018 
Figure 0

Figure 1. Schematic diagrams and corresponding high-resolution transmission electron microscope images of common defects in solids. (a, d) Vacancies. Reprinted with permission from Reference 16. © 2015 Nature Publishing Group. (b, e) Dislocations. Reprinted with permission from Reference 14. © 2015 AAAS. (c, f) Stacking faults (SFs).18 (g, j) Grain boundaries. Reprinted with permission from Reference 17. © 2014 Wiley. (h, k) Twin boundaries.18 (i, l) Nanoprecipitates. Reprinted with permission from Reference 12. © 2012 Nature Publishing Group. The insets in (e), (j), and (l) show the morphology of a dislocation, dislocation (on the grain boundary), and nanoprecipitate, respectively.

Figure 1

Figure 2. Normalized accumulation of thermal (dashed) and electrical conductivity (solid lines) for four representative materials. The blue, red, green, and gray lines represent the mean free path (MFP) spectra of SnTe,78 GaAs,76,77 Si,10 and PbTe,66,79 respectively. The electrical conductivities are calculated at an n-type carrier concentration of 1 × 1020, 1 × 1013, 1 × 1014, and 1 × 1017 cm–3 for SnTe, GaAs, Si, and PbTe, respectively. The differences between phonon and electron MFPs provide the possibility to independently manipulate their transport behavior.