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Effects of vibration on passive intermodulation of microwave connector

Published online by Cambridge University Press:  27 June 2019

Tuanjie Li
Affiliation:
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Mingtai Li
Affiliation:
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Wangmin Zhai
Affiliation:
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Jie Jiang
Affiliation:
Honghe University, Mengzi, 661100China
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Abstract

This paper investigates the generation of passive intermodulation (PIM) in coaxial connectors during vibration. A series of experiments were designed and the simulation model and method were proposed for understanding these phenomena. We found that PIM is mainly influenced by the contact stress and contact surface roughness during vibration. Thus, a power spectral density method is presented to identify the roughness parameter of contact surface based on the Weierstrass–Mandelbrot model, and the simulation model and method were verified by the relative experiments. Eventually, some suggestions for engineering application were provided.

Information

Type
Research Papers
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2019 
Figure 0

Fig. 1. The equivalent circuit model.

Figure 1

Fig. 2. Vibration experimental system: (a) horizontal arrangement test system; (b) vertical arrangement test system.

Figure 2

Fig. 3. A finite-element model of connector and its contact stress simulation. (a) CAD model of connector. (b) Simulation result of finite-element model in tightening torque = 10 Nm.

Figure 3

Fig. 4. One-dimensional contact surface scan for a new male connector.

Figure 4

Fig. 5. Parameter identification of fractional roughness of contact surface for a new connector.

Figure 5

Fig. 6. Measured values of third-order PIM power levels for vibrational frequencies with different input powers. (a) Horizontal arrangement test, (b) Vertical arrangement test.

Figure 6

Fig. 7. One-dimensional contact surface scan for a worn male connector.

Figure 7

Fig. 8. Parameter identification of fractional roughness of contact surface for a worn connector.

Figure 8

Fig. 9. Comparison of measured and calculated values of third-order PIM power levels with different input powers.

Figure 9

Fig. 10. Comparison of measured and calculated values of third-order PIM power levels with different tightening torques.

Figure 10

Fig. 11. Measured values of third-order PIM power levels with horizontal vibrational acceleration. (a) The small spacing accelerations, (b) The large spacing accelerations.

Figure 11

Fig. 12. Measured values of third-order PIM power levels with vertical vibrational acceleration. (a) The small spacing accelerations, (b) The large spacing accelerations.

Figure 12

Fig. 13. Measured values of third-order PIM power levels with different vibrational duration.