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Utilizing alternate target deposition to increase the magnetoelectric effect at room temperature in a single phase M-type hexaferrite

Published online by Cambridge University Press:  27 June 2017

Hessam Izadkhah*
Affiliation:
Microwave Material Laboratory of Northeastern University, Boston, MA 02115, USA Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA
Saba Zare
Affiliation:
Microwave Material Laboratory of Northeastern University, Boston, MA 02115, USA Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA
Sivasubramanian Somu
Affiliation:
Kostas Micro and Nano Fabrication Facility, Northeastern University, Boston, MA 02115, USA
Fabrizio Lombardi
Affiliation:
Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA
Carmine Vittoria
Affiliation:
Microwave Material Laboratory of Northeastern University, Boston, MA 02115, USA Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA
*
Address all correspondence to Hessam Izadkhah at izdkhah.h@husky.neu.edu

Abstract

The Magnetoelectric (ME) effect has been observed in single phase hexaferrite bulk and thin films of SrCo2Ti2Fe8O19. In this paper we demonstrate that the ME linear coupling depends strongly on the Co ion concentration relative to the Ti ion concentration exhibiting extremum points at a concentration consistent with above formula. The Alternating Target Laser Ablation Deposition technique was utilized to deposit ME hexaferrite films for the first time. This allows for the deposition of transition metal ions at specific sites in the basic unit cell of the hexaferrite.

Information

Type
Functional Oxides Research Letter
Copyright
Copyright © Materials Research Society 2017 
Figure 0

Figure 1. Crystal Structure of M-type hexaferrite.

Figure 1

Table I. Composition of the M-type hexaferrite thin film deposited by ATLAD technique.

Figure 2

Figure 2. SEM of the film deposited by ATLAD technique and post annealed for 40 min at 1050 °C.[19]

Figure 3

Figure 3. VSM of the Film deposited by ATLAD technique post annealed for 40 min at 1050 °C. The coercivity of the film is shown in the inset plot.

Figure 4

Figure 4. M versus H below magnetic saturation fields.[17]

Figure 5

Figure 5. Magnetization versus applied voltage to the substrate film and ME film.

Figure 6

Figure 6. XRD of the film deposited by ATLAD technique and annealed for 40 min.

Figure 7

Figure 7. Variation of α versus Co concentration (x) [adopted from[17]].

Figure 8

Figure 8. FMR of the ME film deposited by ATLAD technique.