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Condensation heat transfer on superhydrophobic surfaces

Published online by Cambridge University Press:  15 May 2013

Nenad Miljkovic
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA; nmiljkov@mit.edu
Evelyn N. Wang
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA; enwang@mit.edu

Abstract

Condensation is a phase change phenomenon often encountered in nature, as well as used in industry for applications including power generation, thermal management, desalination, and environmental control. For the past eight decades, researchers have focused on creating surfaces allowing condensed droplets to be easily removed by gravity for enhanced heat transfer performance. Recent advancements in nanofabrication have enabled increased control of surface structuring for the development of superhydrophobic surfaces with even higher droplet mobility and, in some cases, coalescence-induced droplet jumping. Here, we provide a review of new insights gained to tailor superhydrophobic surfaces for enhanced condensation heat transfer considering the role of surface structure, nucleation density, droplet morphology, and droplet dynamics. Furthermore, we identify challenges and new opportunities to advance these surfaces for broad implementation in thermofluidic systems.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2013 
Figure 0

Figure 1. Condensation heat transfer modes and performance. Images of (a) filmwise condensation on a smooth hydrophilic Cu tube, (b) dropwise condensation on a silane coated smooth Cu tube, (c) jumping-droplet superhydrophobic condensation on a nanostructured CuO tube (inset: magnified view of the jumping phenomena, scale bar is 500 µm), and (d) flooding condensation on a nanostructured CuO tube.47 (e) Heat transfer measurements for dropwise condensation of steam at near-atmospheric pressure30 (ΔT = Tsat(Pv)–Twall). Superhydrophobic region shows expected performance enhancement due to increased droplet mobility. Note: NCG, non-condensable gas; Tsat, vapor saturation temperature; Pv, vapor pressure; Twall, condensing surface temperature. Reprinted with permission from Reference 47. © 2013 American Chemical Society.

Figure 1

Figure 2. Condensing droplet morphologies. Time-lapse schematics of a (a) Wenzel (W) droplet where liquid fills the structures beneath the droplet; (b) partially wetting (PW) droplet where the liquid partially fills the structure beneath the droplet, and (c) suspended (S) droplet where an air layer fills the structure beneath the droplet84 (schematics not to scale). Environmental scanning electron microscopy120–130 images of droplets with the (d) W, (e) PW, and (f) S morphologies on a nanostructured surface (h = 6.1 μm, l = 2 μm, d = 300 nm). Note: t, time; θw, Wenzel droplet contact angle (Equation 2); θpw, partially wetting contact angle; θs, suspended droplet contact angle. Reprinted with permission from Reference 84. © 2013 American Society of Mechanical Engineers.

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Figure 3. Effect of structure length scale and nucleation density on emergent droplet morphology. (a) Schematic of a droplet growing within the confines of the structures. The liquid can either grow laterally by filling the adjacent structures or by growing upward above the structures.54 Condensed droplet growth observed using environmental scanning electron microscopy on structured surfaces with (b) Cassie droplets, where l = 2 μm, and (c) Wenzel droplets, where l = 4 μm.55 Scale bar for (b, c) is 60 μm. Condensation behavior on a microstructured surface (l = 4.5 μm, d = 2 μm, h = 5 μm, and E* = 0.75 ± 0.04) is shown at a fixed location with a scaled coalescence length of (d) 〈L〉/l = 3.54 ± 2.43 (PW droplets) and (e) 〈L〉/l = 2.04 ± 0.6 (W droplets).55 Scale bar for (d, e) is 50 μm. (f) Regime map characterizing the dominant wetting behavior observed during condensation with coordinates of 〈L〉/l and E*. PW morphologies (red □) emerge at large 〈L〉/l and E* ≲ 1 (shaded region). Wenzel morphologies (blue ○) emerge at low 〈L〉/l and/or E* ≳ 1.55 Note: E*, dimensionless energy ratio; θPW, advancing contact angle; Dm, wetted basal diameter; 〈L〉, average distance between droplet nucleation sites. Adapted with permission from Reference 55. © 2013 American Chemical Society, and Reference 54. © 2012 Royal Society of Chemistry.

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Figure 4. Effect of droplet morphology on growth rate. Time evolution of the average droplet diameter for (a) partially wetting (PW) and (b) suspended (S) droplets (h = 6.1 μm, l = 2 μm, d = 300 nm). The S droplet had a slower growth rate than the PW droplet due to poor thermal contact between the base and substrate.67 (c) PW and S droplet model schematics and thermal resistance diagram showing the liquid-vapor interface (Ѱi), droplet conduction (Ѱd), hydrophobic coating (Ѱhc), pillar (Ѱp), and gap (Ѱg) thermal resistances.67 Note: t, time; Ts, substrate temperature at the base of a pillar; Ts′, substrate temperature in between two adjacent pillars; h, pillar height; i, interfacial heat transfer coefficient; Tsat, vapor saturation temperature; R(t), droplet radius as a function of time; Ti, liquid-vapor interface temperature; Tb1, hydrophobic coating surface temperature on the tips of the pillars; Tb2, pillar/hydrophobic coating interface temperature; Tb3, hydrophobic coating surface temperature in the valleys of the pillars; q, individual droplet heat transfer rate; δhc, hydrophobic coating thickness; θS, suspended droplet contact angle; θPW, partially wetting droplet contact angle. Reprinted with permission from Reference 67. © 2012 American Chemical Society.

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Figure 5. Droplet departure modes—gravitational shedding versus jumping. Dropwise condensation on a horizontally oriented (a) smooth hydrophobic surface and (b) structured two-tier superhydrophobic surface (with micro-pillars visible). Stages 1–3 of the condensation process characterize the initial nucleation, immobile coalescence, and mobile coalescence (jumping droplets), respectively.29 (c) Coalescing process of two droplets. Upper photos: side-view images of two condensed drops with diameters of 302 and 252 µm during merging; lower: modeled coalescence process.83 (d) Coalescence-induced transformation and jumping of the merged droplet. Upper photos: side-view images of coalescence-induced droplet jumping; lower: modeled coalescence-induced droplet jumping.83 Reprinted with permission from Reference 29. © 2009 The American Physical Society, and Reference 83. © 2012 Elsevier.

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Figure 6. Fabricated scalable nanostructured surfaces. Field emission scanning electron microscopy images of a CuO nanostructured surface with (a) top view, (b) side view, and (c) micro-goniometer contact angle measurement after hydrophobic functionalization (θA = 169.2 ± 2.6°). Nanostructured CuO was formed by immersing the cleaned copper into a hot (96 ± 3°C) alkaline solution composed of NaClO2, NaOH, Na3PO4·12H2O, and DI water (3.75:5:10:100 wt%). The sharp, knife-like CuO structures have characteristic heights, h ≈ 1 μm, solid fraction, φ ≈ 0.023, and roughness factor, r ≈ 10.47 (d, e) Scanning electron microscopy (SEM) images of the copper surface structures fabricated via wet chemistry by immersing clean copper into a mixture solution containing 2.5 mol/L NaOH and 0.1 mol/L (NH4)2S2O8 at room temperature for 12 min.93 (f) Contact angle measurement on functionalized nanostructured copper surface (5 μL droplet, θA = 159 ± 2°).93 (g) SEM images of a nanostructured zinc surface showing a micro-flower-like structure (size, a ≈ 12 µm; separation, b ≈ 25 µm; height c ≈ 10 µm).92 Nanostructured zinc was formed by immersing the zinc substrate in 2 mol/L urea solution prepared with deionized water and N-N-dimethylformamide in 2:1 volume ratio, in a sealed bottle and kept at 80°C for 20–24 hours. (h) The micro-flower area inside the circle in (g) at large magnification. It shows nano-sheets with an average thickness of 300 nm.92 (i) Contact angle measurement of a 3 µl water droplet on the ZnO surface. All three scalable surfaces showed high degrees of superhydrophobicity (c, f, and i), promising potential for enhanced condensation heat transfer performance. Reprinted with permission from References 47 and 93. © 2013 American Chemical Society, and Reference 92. © 2010 Elsevier.

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Figure 7. Experimental heat transfer results. (a) Schematic of the planar jumping-droplet thermal diode (not to scale) in forward mode with jumping droplets returning the working fluid from the low temperature (T-) superhydrophobic condenser to the high temperature (T+) superhydrophilic evaporator for continuous phase-change heat transfer.101 (b) Forward thermal conductivity (kf) versus the average vapor temperature of the thermal diode (Tv). For all three orientations tested (sideways, with gravity, and against gravity), the thermal diode performance was the same, highlighting the advantageous orientation independence of condensers having jumping droplet departure.101 At higher vapor temperatures (Tv > 50°C), boiling in the evaporator was initiated, resulting in orientation dependence (dotted line). (c) Schematic showing setup for condensation experiments. The tube sample (DOD = outer diameter = 6.35 mm, DID = inner diameter = 3.56 mm, L = length = 131 mm) was cooled via chilled water flowing inside the tube at 5 ± 0.1 L/min.47 (d) Experimental and theoretical steady-state condensation coefficient (c) as a function of saturated vapor pressure (Pv) for tube surfaces shown in (c) undergoing filmwise, dropwise, flooding (four different chemical oxidation times, t = 5, 10, 20, and 45 min), and jumping (t = 10 min) condensation.47 Jumping condensation shows the highest condensation heat transfer coefficient for low supersaturations (S < 1.12).47 Adapted with permission from Reference 101. © 2012 American Institute of Physics, and Reference 47. © 2013 American Chemical Society.