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Influence of deformation inhomogeneity on the annealing behavior of drawn oxygen-free high conducting copper

Published online by Cambridge University Press:  23 January 2013

Daudi R. Waryoba*
Affiliation:
Department of Engineering, Penn State University - DuBois, Pennsylvania 15801
Primus V. Mtenga
Affiliation:
Department of Civil and Environmental Engineering, FAMU-FSU College of Engineering, Tallahassee, Florida 32310
Jagabanduhu Chakrabarty
Affiliation:
National High Magnetic Field Laboratory, Tallahassee, Florida 32310
Peter N. Kalu
Affiliation:
Department of Mechanical Engineering, FAMU-FSU College of Engineering, Tallahassee, Florida 32310; and National High Magnetic Field Laboratory, Tallahassee, Florida 32310
*
a) Address all correspondence to this author. e-mail: drw29@psu.edu

Abstract

Oxygen-free high conducting copper wires drawn to true strains of 2.3, 3.1, and 3.6 exhibit inhomogeneity in the form of three distinct concentric regimes: the inner core, the midsection, and the outer region. While the microtexture of the inner core was dominated by a strong <111> + weak <100> duplex fiber texture, the midsection and the outer region had a comparatively weaker texture. An upper bound plasticity modeling and the nanohardness measurement revealed that the midsection was the most strained region. Upon annealing at 170 °C, the 2.3-strained wire did not recrystallize, whereas the 3.1- and 3.6-strained wires exhibited partial recrystallization. For the 3.6 wire, the inner core was unrecrystallized, while the midsection and outer region recrystallized with strong <100> + weak <111> fiber texture. The recrystallized grains were classified as type “A” grains, which grew laterally with <100>//DD orientation, and type “B” grains, which generally grew axially with <111>//DD orientation.

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Copyright © Materials Research Society 2013
Figure 0

FIG. 1. Optical micrographs showing (a) elongated deformed grains (parallel to DD) and (b) the three concentric regimes in the intermediate-strained wire.

Figure 1

FIG. 2. The nanohardness profile from the edge to the center of the intermediate-strained and highly strained wires.

Figure 2

FIG. 3. OIM orientation map (orientations//DD) and corresponding IPFs of the intermediate-strained wire, showing grain orientation in the outer region, midsection, and inner core region (contours are at 1, 2, 3, … times random).

Figure 3

FIG. 4. Variation of nanohardness across intermediate and highly strained wires after isothermal annealing at 170 °C for 1 h.

Figure 4

FIG. 5. OIM IQ maps of the annealed OFHC copper showing (a) elongated and unrecrystallized microstructure of the low-strained wire, (b) pockets of recrystallized grains (light shading) in the intermediate-strained wire, and (c) partial recrystallization in the highly strained wire, after isothermal annealing at 170 °C for 1 h.

Figure 5

FIG. 6. OIM IPF maps (orientations//DD) of OFHC copper wires showing grain orientations in (a) low-strained wire, (b) intermediate-strained wire, and (c) highly strained wire, after isothermal annealing at 170 °C for 1 h. Grain X is referenced in Sec. III. B. 4.

Figure 6

FIG. 7. Distribution of the microtexture across the transverse section of (a) low-strained wire, (b) intermediate-strained wire, and (c) highly strained wire, after isothermal annealing at 170 °C.

Figure 7

FIG. 8. Grain shape and inclination used to categorize axial and lateral recrystallized grains in highly strained wire, after isothermal annealing at 170 °C.

Figure 8

FIG. 9. Distribution of type “A” and type “B” grains in terms of the inclination angle, β.

Figure 9

FIG. 10. Grain size distribution of type “A” and type “B” grains in terms of the inclination angle β of their major axis.

Figure 10

FIG. 11. OIM discrete IPFs representing the microtexture of (a) type “A” and (b) type “B” grains.

Figure 11

FIG. 12. The geometrical parameters, deformation zones, and velocity components during wire drawing through a conical die (adapted from Ref. 17).

Figure 12

FIG. 13. Strain distribution across the intermediate-strained wire based on the upper bound plasticity simulation. The demarcation of the three regions is based on the results of Fig. 1.