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Planarized arrays of aligned, untangled multiwall carbon nanotubes with Ohmic back contacts

Published online by Cambridge University Press:  26 November 2014

C. Rochford*
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185, USA
S.J. Limmer
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185, USA
S.W. Howell
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185, USA
T.E. Beechem
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185, USA
M.P. Siegal
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185, USA
*
a) Address all correspondence to this author. e-mail: crochfo@sandia.gov

Abstract

Vertically aligned, untangled planarized arrays of multiwall carbon nanotubes (MWNTs) with Ohmic back contacts were grown in nanopore templates on arbitrary substrates. The templates were prepared by sputter depositing Nd-doped Al films onto W-coated substrates, followed by anodization to form an aluminum oxide nanopore array. The W underlayer helps eliminate the aluminum oxide barrier that typically occurs at the nanopore bottoms by instead forming a thin WO3 layer. The WO3 can be selectively etched to enable electrodeposition of Co catalysts with control over the Co site density. This led to control of the site density of MWNTs grown by thermal chemical vapor deposition, with W also serving as a back electrical contact. Ohmic contact to MWNTs was confirmed, even following ultrasonic cutting of the entire array to a uniform height.

Information

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Articles
Copyright
Copyright © Materials Research Society 2015 
Figure 0

FIG. 1. (a) SEM image of the test tube-shaped pore structure and barrier oxide at the pore bottoms after anodizing an Al film without a W underlayer. The barrier oxide is marked by arrows. (b)–(c) SEM images of the tungsten/pore bottom interface before and after etching of the WO3 plug, respectively. The arrows point to an example WO3 plug and a resulting void after removal. All scale bars are 200 nm.

Figure 1

FIG. 2. (a)–(c) Representative SEM images of Co site density in ion-milled pores for 10-, 60-, and 120-min WO3 etch times, respectively. Scale: pore diameter is 75 nm. (d) Co site density versus WO3 etch time. The line is a guide to the eye.

Figure 2

FIG. 3. SEM images of (a) the MWNT array overgrowth above the AAO surface and (b) the MWNTs emerging from the AAO pore openings.

Figure 3

FIG. 4. Raman spectra of the MWNT array overgrowth above the AAO and an individual MWNT cut from the same array overgrowth by ultrasonication. Insets show SEM images of the material sampled for each spectrum.

Figure 4

FIG. 5. (a) Low- and (b) high-magnification SEM images of a MWNT array after ultrasonic cutting. The inset in (b) shows the ends of MWNTs before ultrasonic cutting.

Figure 5

FIG. 6. (a) Conductive AFM map of current between the top of the AAO/MWNT array and the underlying W layer. (b) I–V data from three individual MWNTs in the array showing Ohmic conduction through the MWNT, the MWNT-Co interface and the Co-W interface after ultrasonic cutting.