Hostname: page-component-74656f9884-j7cmm Total loading time: 0 Render date: 2026-11-07T03:34:59.303Z Has data issue: false hasContentIssue false

Microstructural evolution and thermal stability of 1050 commercial pure aluminum processed by high-strain-rate deformation

Published online by Cambridge University Press:  10 November 2015

Yang Yang
Affiliation:
School of Material Science and Engineering, Central South University, Changsha 410083, China; Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, China; State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China; and Key Laboratory of Ministry of Education for Nonferrous Metal Materials Science and Engineering, Central South University, Changsha 410083, China
Ya Dong Chen*
Affiliation:
School of Material Science and Engineering, Central South University, Changsha 410083, China
Hai Bo Hu
Affiliation:
Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, China
Tie Gang Tang
Affiliation:
Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, China
Ren Rong Long
Affiliation:
State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China
Qing Ming Zhang
Affiliation:
State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China
*
a)Address all correspondence to this author. e-mail: yadongchen1990@163.com

Abstract

Microstructural and property evolution of 1050 commercial pure aluminum subjected to high-strain-rate deformation (1.2–2.3 × 103 s−1) by split Hopkinson pressure bar (SHPB) and subsequent annealing treatment were investigated. The as-deformed and their annealed samples at 373–523 K were characterized by transmission electron microscopy (TEM) and microhardness tests. TEM observations reveal that the as-deformed sample is mainly composed of a lamellar structure, whose transverse/longitudinal average subgrain/cell sizes are 293 and 694 nm, respectively. The initial coarse grains are refined significantly. The initial lamellar grain structures are subdivided into pancake-shaped subgrains due to a gradual transition by triple junction motion at 473 K, and then a dramatic microstructural coarsening is observed at 523 K. It is suggested that annealing behavior of this dynamic loading structure is better considered as a continuous process of grain coarsening or continuous recovery.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2015 
Figure 0

FIG. 1. Schematic diagram of SHPB.

Figure 1

FIG. 2. The electrical signals of SHPB.

Figure 2

FIG. 3. (a) The strain rate–time curves and (b) stress–strain curves obtained during high-strain-rate deformation.

Figure 3

FIG. 4. TEM image of the as-deformed sample. The illustration is the selected area diffraction pattern.

Figure 4

FIG. 5. Statistical distribution of subgrain/cell sizes. DT and DL are the spacings between GNBs and IDBs of the as-deformed samples.

Figure 5

FIG. 6. TEM images of the as-deformed specimens after 1 h annealing at various temperatures and the black arrow indicates the loading direction. (a) 373 K, (b) 423 K, (c) 473 K, and (d) 523 K.

Figure 6

FIG. 7. Statistical distribution of subgrain/cell sizes. (a)–(c) are the spacings between GNBs (DT) and IDBs (DL) of the samples after 1 h annealing treatment at 373, 423, and 473 K, respectively; (d) is the grain size distribution of the sample after 1 h annealing treatment at 523 K.

Figure 7

FIG. 8. Microhardness curve of the as-deformed samples as a function of annealing temperatures.

Figure 8

TABLE I. The average grain sizes of pure aluminum produced by different technologies.

Figure 9

FIG. 9. The kinetics of grain growth is illustrated by plotting log(D2 − D02) versus 1/T. It shows a discontinuous transition from low-temperature (regime I) to high-temperature (regime II).