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On the validity regime of the bulge equations

Published online by Cambridge University Press:  04 April 2012

Jan Neggers
Affiliation:
Department of Mechanical Engineering, Eindhoven University of Technology, 5612 AZ Eindhoven, The Netherlands
Johan P.M. Hoefnagels*
Affiliation:
Department of Mechanical Engineering, Eindhoven University of Technology, 5612 AZ Eindhoven, The Netherlands
Marc G.D. Geers
Affiliation:
Department of Mechanical Engineering, Eindhoven University of Technology, 5612 AZ Eindhoven, The Netherlands
*
a)Address all correspondence to this author. e-mail: j.p.m.hoefnagels@tue.nl

Abstract

The plane strain bulge test technique is a powerful and acknowledged technique for characterizing the mechanical behavior of thin films. In a bulge test analysis, the stress and strain are derived from the measured quantities using analytical approximations of the deformed geometry (bulge equations). To improve the bulge test, the systematic error introduced by these approximations is evaluated and quantified by scrutinizing the method on a finite element model of the bulge test, used as an idealized experiment.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2012
Figure 0

FIG. 1. (a) Schematic of a plane strain bulge test experiment. A slender rectangular membrane with width 2a and thickness h is deflected δ out-of-plane by a pressure P. (b, c) Stress–strain curves obtained by application of the bulge equations to a simulated virtual experiment (explained in the text), compared with the reference (input) stress and strain data, for a membrane thicknesses of 500 nm (b) and 5 μm (c).

Figure 1

FIG. 2. (a) The simulated 2D model of half of the membrane, indicating the boundary conditions. (b) Stress–strain curves of the elastoplastic material model, illustrating the effect of the hardening parameter q.

Figure 2

FIG. 3. (a) Evolution of the bulge profiles, for increasing pressure P, normalized with their deflection δ. The inset figures show the two limiting cases: (i) the DCP and (ii) the cylindrical shape of the Bulge Equations. The (color-coded) dots marked ${\rm{\chi }}_{\rm{c}} $ are the limit positions, for which the curvature $\kappa $ at the left side of the marker deviates less then 0.1% from the curvature in the center. (b) The “cylindricity” (i.e., the relative circular part) of each bulge profile as a function of the dimensionless strain ${\rm{\varepsilon }}/{\rm{\varepsilon }}_y $ for films with various thickness to width ratios $h/a$. (c) The cylindricity ${\rm{\chi }}_{\rm{c}} /a$ of each bulge profile shifted to one master curve by plotting the curves of subfigure (b) as a function of the scaled strain. (d) The same master curve now for various material properties, where “base” refers to the reference copper material properties, “base + Si Substr.” refers to a simulation where the rigid boundary is replaced with the micromachined Si substrate. The variation of ${\rm{\varepsilon }}_y $ is achieved by both varying the Young’s modulus and the yield stress.

Figure 3

FIG. 4. The relative systematic error in the stress ${\rm{\sigma }}_{{\rm{be}}} $ and strain ${\rm{\varepsilon }}_{{\rm{be}}} $ obtained with the bulge equations and in the strain ${\rm{\varepsilon }}_{{\rm{dcp}}} $ obtained with the DCP solution as a function of the scaled strain ${\rm{\varepsilon }}^ * $ (compared with the reference stress and strain from the simulation). Additionally, the relative systematic error in the stress from the bulge equations is shown for various levels of prestrain (i.e., ${\rm{\varepsilon }}_0 \, = \,[0,\,\,0.5,\,\,0.8,\,\,0.9]\,{\rm{\varepsilon }}_y $). Logically, for small strains, the DCP solution is more accurate in the strain than the bulge equations.