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Strategies to tailor serrated flows in metallic glasses

Published online by Cambridge University Press:  22 January 2019

Zhe Fan*
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, USA
Qiang Li
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, USA
Cuncai Fan*
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, USA
Haiyan Wang
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, USA
Xinghang Zhang*
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, USA
*
a)Address all correspondence to these authors. e-mail: zfan.phd@gmail.com

Abstract

Serrated flow is one important characteristic of shear bands through which metallic glasses (MGs) accommodate plastic deformation. Serrated flow can be affected by intrinsic properties such as elastic modulus or extrinsic variables such as strain rate. However, the influences of pre-deformation and interfaces on serrated flow are less well understood. In this study, by using in situ micropillar compression inside a scanning electron microscope, we show that pre-deformation (consisting of cyclic loading/unloading below the nominal elastic limit) suppresses serrated flows in amorphous-CuNb but enhances serrated flows in amorphous-CuZr at both high and low strain rates. Moreover, layer interfaces in Cu/amorphous-CuNb multilayers mitigate serrated flows, and the average stress drop and strain duration associated with shear banding process can be tailored. Strain accommodation and energy dissipation via shear banding have clear impact on serrated flows. This study provides new perspectives on tailoring serrated flows and enhancing plastic deformation of MGs.

Figure 0

Figure 1: In situ microcompression tests of a-CuNb pillars without pre-deformation. (a) Representative true stress–strain curve of a-CuNb pillars tested at 5 × 10−3 s−1 showing frequent and large stress-drops after yielding. Magnified stress–strain curve shows how stress-drop and strain duration are determined. (b) SEM image of a-CuNb pillar tested at 5 × 10−3 s−1 after compression. (c) True stress–strain curve of a-CuNb pillars tested at 2.5 × 10−2 s−1 showing much less and smaller stress-drops. (d) SEM image of a-CuNb pillar tested at 2.5 × 10−2 s−1 after compression. (e) Distribution of stress-drops at 5 × 10−3 s−1 and 2.5 × 10−2 s−1. The pillars tested at 2.5 × 10−2 s−1 exhibit a smaller average stress-drop and a narrower distribution. (f) Comparison of stress-drops at 5 × 10−3 s−1 (blue squares) and 2.5 × 10−2 s−1 (red triangles) with respect to true strain. Shear bands are indicated by the arrows.

Figure 1

Figure 2: In situ microcompression tests of a-CuZr pillars without pre-deformation. Representative true stress–strain curves of a-CuZr pillars tested at (a) 5 × 10−3 s−1 and (c) 2.5 × 10−2 s−1. The insets show magnified view of stress-drops. SEM images of the pillars after compression showing few obscure shear bands indicated by the arrows at (b) 5 × 10−3 s−1 and (d) 2.5 × 10−2 s−1. (e) Distribution of stress-drops at 5 × 10−3 s−1 and 2.5 × 10−2 s−1. (f) Comparison of stress-drops at 5 × 10−3 s−1 (blue squares) and 2.5 × 10−2 s−1 (red triangles) with respect to true strain.

Figure 2

Figure 3: Demonstration of low-load pre-deformation (mostly elastic tapping) before compression test. (a) Displacement–time curve (load function) for one tapping sequence, including 10 miniscule loading–unloading cycles. The maximum displacement was controlled to be ∼50 nm. True stress–strain curves for three consecutive tapping sequences for (b) a-CuNb and (c) a-CuZr. (d) SEM images from in situ compression test of a-CuNb pillar before and after each tapping sequence showing basically no detectable morphological changes.

Figure 3

Figure 4: The influence of tapping on compression tests of a-CuNb pillars. Comparison of true stress–strain curves of untapped and pre-tapped pillars compressed at (a) 5 × 10−3 s−1 and (c) 2.5 × 10−2 s−1. Stress-drops are significantly reduced for pre-tapped pillars for both strain rates. SEM images of the pre-tapped pillars after compression tests at (b) 5 × 10−3 s−1 and (d) 2.5 × 10−2 s−1 show obvious shear bands indicated by the arrows.

Figure 4

Figure 5: In situ snapshots of untapped and pre-tapped a-CuNb pillars during compression at a strain rate of 5 × 10−3 s−1. (a–d) The pillar morphology during compression for untapped a-CuNb pillar at ∼10%, 17%, 25%, and 30% true strain. (e–h) The morphology for pre-tapped a-CuNb pillar at similar strain level.

Figure 5

Figure 6: The influence of tapping on compression tests of a-CuZr pillars. Comparison of true stress–strain curves of untapped and pre-tapped pillars compressed at (a) 5 × 10−3 s−1 and (c) 2.5 × 10−2 s−1. Tapping enhanced shear serrations for both strain rates. SEM images of pre-tapped pillars after compression tests at (b) 5 × 10−3 s−1 and (d) 2.5 × 10−2 s−1 show prominent shear bands indicated by the arrows compared with the inconspicuous shear bands in untapped pillars after compression as shown in Fig. 2.

Figure 6

Figure 7: In situ snapshots of untapped and pre-tapped a-CuZr pillars during compression at a strain rate of 5 × 10−3 s−1. (a–d) The pillar morphology during compression for untapped a-CuZr pillar at ∼10%, 20%, 30%, and 37% true strain. (e–h) The morphology for pre-tapped a-CuZr pillar at similar strain level.

Figure 7

Figure 8: In situ microcompression tests of Cu1 µm/a-CuNb2 µm/Cu1 µm and Cu/a-CuNb 150 nm pillars tested at 5 × 10−3 s−1. (a) Representative engineering stress–strain curve of Cu1 µm/a-CuNb2 µm/Cu1 µm showing relative smooth curve. (b) The enlarged stress–strain curve from (a) showing stress serrations in the range of tens of MPa. (c) SEM image of the deformed Cu1 µm/a-CuNb2 µm/Cu1 µm pillar shows significant plastic deformation of Cu, whereas a-CuNb contains several shear bands as indicated by arrows. (d) The true stress–strain curve of Cu/a-CuNb 150 nm pillar showing insignificant stress serrations. (e) The magnified view from (d) shows small stress-drops. (f) Deformation leads to obvious extrusion of Cu but not apparent shear bands in the Cu/a-CuNb 150 nm multilayers. Insets in (a) and (d) show SEM images of pillars before compression.

Figure 8

Figure 9: Statistics of stress-drops of a-CuNb and a-CuZr pillars. Distribution of stress-drops of a-CuNb pillars tested with and without tapping at (a) 5 × 10−3 s−1 and (b) 2.5 × 10−2 s−1. (c) The magnitude of average stress-drop for a-CuNb decreases with increasing number of tapping for both strain rates. The distribution of stress-drops for a-CuZr pillars tested with and without tapping at (d) 5 × 10−3 s−1 and (e) 2.5 × 10−2 s−1. (f) The average stress-drop for a-CuZr increases with increasing number of tapping for both strain rates.

Figure 9

Figure 10: Statistics of stress-drops of a-CuNb, Cu1 µm/a-CuNb2 µm/Cu1 µm, and Cu/a-CuNb 150 nm pillars tested at 5 × 10−3 s−1. (a) The distribution and amplitude of stress-drop are broad and large for a-CuNb but become much narrower and smaller for Cu1 µm/a-CuNb2 µm/Cu1 µm and Cu/a-CuNb 150 nm. (b) Comparisons of stress-drop versus strain duration for a-CuNb (black squares), Cu1 µm/a-CuNb2 µm/Cu1 µm (red triangles), and Cu/a-CuNb 150 nm (blue circles). Average stress-drop is similar for Cu1 µm/a-CuNb2 µm/Cu1 µm and Cu/a-CuNb 150 nm, but the average strain duration for Cu/a-CuNb 150 nm is much smaller.

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