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Evaluation of GaN technology in Doherty power amplifier architectures

Published online by Cambridge University Press:  11 March 2010

Paolo Colantonio
Affiliation:
Electronic Engineering Department, Università di Roma Tor Vergata – Via del Politecnico 1, 00133 Rome, Italy.
Franco Giannini
Affiliation:
Electronic Engineering Department, Università di Roma Tor Vergata – Via del Politecnico 1, 00133 Rome, Italy.
Rocco Giofrè*
Affiliation:
Electronic Engineering Department, Università di Roma Tor Vergata – Via del Politecnico 1, 00133 Rome, Italy.
Luca Piazzon
Affiliation:
Electronic Engineering Department, Università di Roma Tor Vergata – Via del Politecnico 1, 00133 Rome, Italy.
*
Corresponding author: R. Giofrè Email: giofr@ing.uniroma2.it
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Abstract

The aim of the present paper is to highlight the possible benefits coming from the use of the GaN high electron-mobility transistor (HEMT) technology in the Doherty power amplifier (DPA) architecture. In particular, the attention is focused on the capabilities and the relevant drawbacks of a GaN HEMT technology when designing DPAs. A deep discussion of the DPA's design guidelines is also presented through the realization of three prototypes implementing different design solutions and working at 2.14 GHz. The first example is a tuned load DPA (TL-DPA), which show an average drain efficiency of 40.7% with 3 W of saturated output power in the obtained 6 dB of output back-off. The second DPA was designed implementing a class F harmonic termination for the main device, which allows an improvement of roughly 15% in output power and efficiency behavior with respect to the TL-DPA. The last DPA was realized implementing a single output matching network for both main and auxiliary devices, which allows a relevant reduction in the size of the resulting DPA, without downgrading the overall performances.

Information

Type
Original Article
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2010
Figure 0

Fig. 1. Theoretical efficiency behavior of a DPA.

Figure 1

Fig. 2. Photo of the active device used.

Figure 2

Fig. 3. Typical DPA architecture.

Figure 3

Fig. 4. Simplified model of the active device.

Figure 4

Fig. 5. I–V output characteristics of the simplified model.

Figure 5

Fig. 6. Evolution of the load curves for both DPA active devices.

Figure 6

Fig. 7. Values of ξ assuring GLF = 0, as a function of the OBO.

Figure 7

Fig. 8. Ratio between Auxiliary and Main maximum currents.

Figure 8

Fig. 9. ΛAux behavior as a function of OBO and ξ.

Figure 9

Fig. 10. Theoretical performances of a DPA.

Figure 10

Fig. 11. Fundamental current and voltage components of Main and Auxiliary.

Figure 11

Fig. 12. Output DC I–V characteristics of the used active device.

Figure 12

Fig. 13. Photo of the realized GaN TL-DPA.

Figure 13

Fig. 14. Intrinsic load impedances of Main and Auxiliary devices.

Figure 14

Fig. 15. Measurements of the realized TL-DPA compared with the simulations.

Figure 15

Fig. 16. Photo of the realized GaN class F-DPA.

Figure 16

Fig. 17. Comparison between the simulated and measured performances of the class F-DPA.

Figure 17

Fig. 18. Comparison between the measured performances of the TL-DPA and the class F-DPA.

Figure 18

Fig. 19. Photo of the realized DPA.

Figure 19

Fig. 20. Measured output spectra for 3GPP WCDMA signal.