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Hot deformation behavior and processing maps of Ti–6Al–4V alloy with starting fully lamellar structure

Published online by Cambridge University Press:  17 September 2018

Wenjing Zhang
Affiliation:
School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China
Hua Ding*
Affiliation:
School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China
Jingwei Zhao
Affiliation:
School of Mechanical, Materials, Mechatronic and Biomedical Engineering, University of Wollongong, NSW 2522, Australia
Bo Yang
Affiliation:
School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China
Wenjing Yang
Affiliation:
School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China
*
a)Address all correspondence to this author. e-mail: hding@263.net

Abstract

The hot deformation behavior of Ti–6Al–4V alloy with starting fully lamellar microstructure was investigated by conducting isothermal hot compression tests at the temperature of 700–1000 °C and strain rate of 0.001–10 s−1. The deformation activation energy is calculated to be 342 kJ/mol at temperatures from 750 to 850 °C, whereas the higher apparent activation energy of 610 kJ/mol is obtained at a high temperature regime of 900–1000 °C. The relationship between the dynamic softening behavior and deformation parameters was analyzed by power dissipation efficiency η, which shows an increasing trend as the deformation temperature increases and strain rate decreases, respectively. Processing maps were constructed. The instability flow is dominated by the presence of adiabatic shear bands, and the dynamic softening is mainly caused by a combination effect of dynamic recrystallization and dynamic recovery. Moreover, straining is found to have a positive effect on lowering the phase transformation temperature.

Information

Type
Article
Copyright
Copyright © Materials Research Society 2018 
Figure 0

FIG. 1. Lamellar microstructure of the heat-treated Ti–6Al–4V alloy.

Figure 1

FIG. 2. True flow stress–strain curves of the Ti–6Al–4V alloy deformed at different temperatures: (a) 750 °C, (b) 850 °C, and (c) 950 °C.

Figure 2

FIG. 3. Relationship between (a) $\ln \dot{\varepsilon } - \ln \sigma$; (b) $\ln \dot{\varepsilon } - \sigma$.

Figure 3

FIG. 4. Relationship between $\ln \dot{\varepsilon } - \ln \left[ {\sinh \left( {\alpha \sigma } \right)} \right]$ for (a) 750–850 °C and (b) 900–1000 °C, as well as the relationship between ln [sinh(ασ)] − 1000/T for (c) 750–850 °C and (d) 900–1000 °C.

Figure 4

TABLE I. The apparent deformation energy (Q) of the Ti–6Al–4V alloy during the hot compression test.

Figure 5

FIG. 5. Variation of ln (σ) versus $\ln \left( {\dot{\varepsilon }} \right)$ at different temperatures for the Ti–6Al–4V alloy.

Figure 6

FIG. 6. Variations of power dissipation efficiency and true strain at different strain rates: (a) 750 °C, (b) 850 °C, and (c) 950 °C.

Figure 7

FIG. 7. Processing maps of the Ti–6Al–4V alloy at the strains of (a) 0.3, (b) 0.5, (c) 0.69, and (d) all the strains.

Figure 8

FIG. 8. OM microstructure of the specimens deformed in the temperature range of 750–1000 °C at the strain rate of 0.1–10 s−1: (a) 750 °C and 10 s−1, (b) 850 °C and 10 s−1, (c) 900 °C and 10 s−1, (d) 950 °C and 10 s−1, (e) 1000 °C and 10 s−1, (f) 750 °C and 1 s−1, (g) 850 °C and 1 s−1, (h) 900 °C and 1 s−1, (i) 950 °C and 1 s−1, (j) 1000 °C and 1 s−1, and (k) 750 °C and 0.1 s−1.

Figure 9

FIG. 9. OM, SEM, and TEM images for the deformed specimens with the strain of 0.69 at the temperature and strain rate of 0.1 s−1 and 750 °C for (a) and (b), 0.001 s−1 and 750 °C for (c) and (d), 0.1 s−1 and 850 °C for (e) and (f), 0.001 s−1 and 850 °C for (g) and (h), 0.1 s−1 and 950 °C for (i) and (j), and 0.001 s−1 and 950 °C for (k) and (l). Here, the TEM image corresponded to SEM or OM image on its left side.