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Compositional and microstructural evolution during annealing of Terfenol-D nanoparticulate films

Published online by Cambridge University Press:  24 August 2011

James Ma
Affiliation:
Materials Science and Engineering Program, University of Texas at Austin, Austin, Texas 78731
Michael F. Becker
Affiliation:
Materials Science and Engineering Program, University of Texas at Austin, Austin, Texas 78731; and Department of Electrical and Computer Engineering, University of Texas at Austin, Austin, Texas 78731
John W. Keto
Affiliation:
Materials Science and Engineering Program, University of Texas at Austin, Austin, Texas 78731; and Department of Physics, University of Texas at Austin, Austin, Texas 78731
Desiderio Kovar*
Affiliation:
Materials Science and Engineering Program, University of Texas at Austin, Austin, Texas 78731; and Department of Mechanical Engineering, University of Texas at Austin, Austin, Texas 78731
*
b)Address all correspondence to this author. e-mail: dekovar@austin.utexas.edu

Abstract

Although highly magnetostrictive thin films of Terfenol-D have been produced by a variety of methods, high-quality thick films have proved to be far more challenging to produce. To date, thick film processes have resulted in nanoparticulate films that contain significant porosity that reduces stiffness and results in oxidation and poor magnetostrictive performance. With the goal of understanding microstructural and compositional factors that affect performance, nanoparticulate Terfenol-D thick films were produced by laser ablation of microparticle aerosols combined with supersonic impaction. X-ray diffraction, scanning electron microscopy, transmission electron microscopy, x-ray photon spectroscopy, and magnetic measurements were performed on nanoparticles and on films as-deposited and after annealing in vacuum or in a reducing atmosphere. These measurements show that segregation occurs during oxidation of the films, prior to annealing, and results in films with poor magnetostriction. The segregation persists during annealing with no visible changes to the morphology or density of the nanoparticulate films exposed to temperatures as high as 800 °C. These results suggest that oxidation and segregation must be avoided to produce highly magnetostrictive thick films.

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Articles
Copyright
Copyright © Materials Research Society 2011
Figure 0

FIG. 1. Hysteresis curves for films annealed (a) in vacuo and (b) reduction annealed as a function of annealing temperature.

Figure 1

FIG. 2. Magnetization and coercivity of films as function of reduction-annealing temperature for reduction-annealed films (RA) and films annealed in vacuo.

Figure 2

FIG. 3. X-ray diffraction spectra for films annealed in vacuo at temperatures ranging from 300 to 700 °C. Also shown are the known peak intensities for the for the alumina substrate (A = alumina) and for elemental iron (▲ = Fe).

Figure 3

FIG. 4. X-ray diffraction spectra for films annealed in a reducing atmosphere at temperatures ranging from 250 to 950 °C. Also shown are the known peak intensities for the Fe–rare earth compound (Fe2R, where R = Tb or Dy) and for the alumina substrate (A = alumina). v = R2O3 and ▲ = Fe.

Figure 4

FIG. 5. (a) Scanning transmission electron microscope (STEM) image of and (b) bright-field TEM image of NPs, and corresponding nanobeam EDS spectra taken (c) in the shell at points 1 and from (d) the core taken at point 2.

Figure 5

FIG. 6. Region for terbium showing spectra as a function of sputtering depth. XPS spectra for (a) 2p1/2 and 2p3/2 regions for iron and (b) 5d5/2 region for terbium showing spectra as a function of sputtering depth. Vertical lines show known locations of peaks for iron and iron oxides16 and for terbium and terbium oxides.17,18

Figure 6

FIG. 7. (a) Plan-view SEM micrograph of film after reduction annealing showing extensive cracking. (b) Cross-sectional SEM micrograph of film after annealing showing cracking and delamination of the film.

Figure 7

FIG. 8. SEM cross sections of films after reduction-annealing at temperatures of (a) 250 °C, (b) 375 °C, (c) 500 °C, and (d) 800 °C.