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Comparing sintering and atomic layer deposition as methods to mechanically reinforce nanocolloidal crystals

Published online by Cambridge University Press:  14 December 2015

Di Zhang
Affiliation:
Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania 19085, USA
Yue Xu
Affiliation:
Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania 19085, USA
Gang Feng*
Affiliation:
Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania 19085, USA
Yun-Ru Huang
Affiliation:
Department of Chemical and Biomolecular Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA
Daeyeon Lee
Affiliation:
Department of Chemical and Biomolecular Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA
*
a) Address all correspondence to this author. e-mail: gang.feng@villanova.edu

Abstract

Nanocolloidal crystals (NCCs) have promising applications in optical and photonic devices. However, it is critical to mechanically reinforce NCCs for device reliability, since as-synthesized NCCs are fragile due to weak interparticle bonding. Thermal sintering is currently the most common reinforcement technique; however, this method could induce serious cracking and is not suitable for temperature-sensitive materials. In this study, by characterizing silica NCCs reinforced through sintering and alumina atomic layer deposition (ALD), we find that the ALD treatment is much more effective for hardening, stiffening, and more importantly toughening NCCs. Thermally sintered NCCs are prone to indentation-induced cracking due to large residual tensile stress, significantly impairing the toughness. In contrast, the ALD treatment toughens NCCs by much over 300%. Our finding provides insights for reinforcing and toughening various nanoparticle-based and nanoporous materials.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2015 
Figure 0

FIG. 1. (a) Top-view and (b) cross-sectional SEM images of a 254 nm NCC. (c) The reflectance spectra of 254 and 289 nm NCCs. The inserted images are the testing spots for the reflectance spectra in 254 and 289 nm NCCs. The spot size is 25 × 25 µm. (d) Hardness H and modulus E of 254 nm NCCs versus sintering temperature Ts. (e) H and (f) E of 254 nm NCCs versus Ts (bottom coordinate) and ALD cycles (top coordinate) in log–log plot. The corresponding values of untreated 254 nm NCC are shown as horizontal dash lines, and each error bar is shown as a shaded region.

Figure 1

FIG. 2. SEM images of ∼1 μm indents on (a)–(d) sintered and (e)–(h) ALD-treated 254 nm NCCs. The sintering temperature and #ALD are labeled. Here, each vertical pair [e.g., (a) and (e)] correspond roughly to the same hardness.

Figure 2

FIG. 3. SEM images of 1-h-sintering-induced cracking gaps, showing freestanding NC chains. The sintering temperatures are labeled.

Figure 3

FIG. 4. Load P versus displacement h for (a) untreated and 950 oC-sintered and (b) 50ALD and 1000 oC-sintered 254 nm NCCs. The pop-in-start displacement hs and pop-in-end displacement he of 1st pop-in versus the 1st pop in load P1st for (c) sintered and (e) ALD-treated 254 nm NCCs, where the slopes ηs (=dhs/dP1st) and ηe (=dhe/dP1st) are also labeled for each sample. Pop-in size Δh (=dhe − dhs) versus hs for (d) sintered and (f) ALD-treated 254 nm NCCs. Here, for easy comparison, we choose the same symbols for each sintering condition in (d) and the corresponding #ALD in (f) with the similar hardness.

Figure 4

FIG. 5. (a)–(e) SEM images of as-assembled, sintered and ALD-treated NCCs as labeled. Here, in (d), a 2-μm-indentation-induced film delamination can be seen in the middle (one piece of film together with the indent on it was delaminated and missing as labeled). The scale bar is 50 µm in (a–e). (f) Fracture toughness Kc versus the normalized ALD thickness τ = t/(d/2) for ALD-treated 289 and 254 nm NCCs based on the WDWC indentation-induced cracks, where t is the ALD thickness (=#ALD × 0.07 nm/cycle), and d/2 is the particle radius.

Figure 5

FIG. 6. The probabilities of three indentation-induced cracking modes for as-assembled and ALD-treated NCCs composed of (a) 254 nm NCs and (b) 289 nm NCs: (i) no cracking, (ii) uncontained long cracking, and (iii) WDWC indentation-induced cracking.

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