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A review of in situ surface functionalization of gallium nitride via beaker wet chemistry

Published online by Cambridge University Press:  08 June 2015

Brady L. Pearce
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27606, USA
Stewart J. Wilkins
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27606, USA
Tania Paskova
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27606, USA; and Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, North Carolina 27606, USA
Albena Ivanisevic*
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27606, USA
*
a) Address all correspondence to this author. e-mail: ivanisevic@ncsu.edu

Abstract

This review focuses on in situ functionalization of gallium nitride (GaN) with different adsorbates in the presence of an etchant. The low-temperature aqueous nature of this process provides a safe, environmentally friendly technique for tailoring the semiconductor's properties for various applications. Surface binding to GaN relies on a native oxide layer or direct attachment to the metal center present on the etched surface. The specifics of the binding mechanism are based on the functional groups present on the adsorbate. The effects of the GaN surface polarity and quality on the modification approach are analyzed. The review summarizes the alteration of GaN properties after the in situ treatment. Quantitative data until now have shown changes in morphological, surface chemical, optical, electronic, and aqueous stability properties. The review concludes with a short outlook on future studies associated with this surface modification approach.

Information

Type
Reviews
Copyright
Copyright © Materials Research Society 2015 
Figure 0

FIG. 1. Pictorial representation of the in situ functionalization process.

Figure 1

FIG. 2. Surface reactions associated with each step of the in situ functionalization.

Figure 2

FIG. 3. Schematic representation of (a) polar c-plane GaN and (b) nonpolar a-plane (purple) and m-plane (red) GaN surface polarities.

Figure 3

FIG. 4. (a) Difference in surface attachment modes based on adsorbate mode; (b) the possible binding modes of phosphonic acid groups to the surface.

Figure 4

FIG. 5. Ga 2p3/2 results highlighting surface changes due to different treatments of the samples with different polarities and crystalline qualities. Treatments were broken up into two temperature schemes (40 and 100 °C) with three different solutions (phosphoric acid, phosphoric acid with 3-bromopropyl phosphonic acid, and phosphoric acid with propylphosphonic acid). Reprinted with permission from Wilkins et al.33

Figure 5

FIG. 6. Bar graph showing the PL changes of polar GaN (top) and nonpolar GaN (bottom) samples grown into thin and bulk layers after treatments with two temperature schemes (40 and 100 °C) and two solutions (phosphoric acid and phosphoric acid with added cysteamine). Reprinted with permission from Wilkins et al.41,50

Figure 6

FIG. 7. Bar graph comparing AFM surface roughness (nm) and KFPM surface potential (mV) of bulk Ga-polar GaN samples after treatments with 40 °C solutions of various phosphoric acid combinations (pure, diluted, and additive assisted). Reprinted with permission from Wilkins et al.47

Figure 7

FIG. 8. Pourbaix diagram of soluble gallium and nitrogen species compiled from elemental databases.62

Figure 8

FIG. 9. ICP-MS data indicating the amount of gallium leached from different GaN samples after soaking in DI water solutions for 7 days. Surface treatments follow the scheme from Fig. 2 with an additional H2O2 capping step post functionalization.