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Use of spherical indentation technique for measurement of property variations of γTiAl

Published online by Cambridge University Press:  24 November 2011

Alfred Cornec*
Affiliation:
Division of Materials Mechanics, Institute of Materials Research, Helmholtz-Zentrum Geesthacht, 21502 Geesthacht, Germany
Mohammad Rizviul Kabir
Affiliation:
Institute of Materials Research, German Aerospace Center (DLR), 51147 Köln, Germany
Norbert Huber
Affiliation:
Division of Materials Mechanics, Institute of Materials Research, Helmholtz-Zentrum Geesthacht, 21502 Geesthacht, Germany
*
a)Address all correspondence to this author. e-mail: alfred.cornec@hzg.de

Abstract

Novel lightweight intermetallic titanium aluminides, so-called γTiAl, provide good strength and creep resistance up to 700 °C. Their stress–strain behavior at room temperature is however strongly confined in elongation due to their low ductility. For studying the stress–strain behavior of γTiAl, the viscoplastic mechanical properties are determined using spherical indentation testing. The identification problem is solved on the continuum level by neural network analysis, which is based on a unified viscoplasticity model. The identified material parameters are validated by comparing the predicted stress–strain behavior with conventional compression tests at different deformation velocities. It was found that the average response of the indentation tests is in good agreement with the compression tests of round bars. Using a spherical indenter tip of R = 0.2 mm, a small volume is tested, offering possibilities for investigation of local property variations due to processing. The experimental indentation curves exhibited wide hysteresis loops, revealing the existence of pure kinematic hardening. Since tensile fracture strength for γTiAl is very low, microcracking occurred during loading as well as during unloading, significantly contributing to the unloading compliance.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2011
Figure 0

FIG. 1.Compression tests. (a) Stress–strain curves (logarithmic strain) from compression tests with different displacement velocities. (b) Development of plastic strain rate during loading.

Figure 1

FIG. 2.Experimental records of specified indentation steps. (a) Applied loading history. (b) Force–depth behavior used for the Artifical Neural Network (ANN) analysis. The unloading–reloading cycles show pronounced hysteresis loops indicating a strong contribution of kinematic hardening to the hardening response.

Figure 2

FIG. 3.Indentation records of force versus depth. Inserted the γTAB microstructure with its lamellar colonies in relation to the indentation size.

Figure 3

FIG. 4.Scanning electron microscopy image of surface under indentation TAB2 after unloading.

Figure 4

FIG. 5.Averaged σ–ε curve of all single indentation curves by exponential fit like Eq. (2) and their standard deviation.

Figure 5

FIG. 6.Diagrams for identified material parameters E, k0, β, γ, m, and σV along the individual indentation points.

Figure 6

FIG. 7.Averaged curve for overstress, σV, with standard deviation SD and calculated from Eq. (3) with average parameters, m and η, from exponential curve fit.

Figure 7

FIG. 8.Comparison of overstress difference, ∆σV, from indentation and compression tests, expressed as the difference of different ram velocities (v1, v2, v3).

Figure 8

FIG. 9.Comparison of stress–strain curves derived from indentation and compression testing.

Figure 9

FIG. 10.Comparison of averaged indentation curves from testing and simulation including last hysteresis loops; curves, connected at the beginning of the fourth hold step.

Figure 10

FIG. 11.Axisymmetric stress fields from simulations for certain load levels for the averaged indentation curve. (a) Maximum shear stress field on the first loading path. (b) Maximum circumferential stress field under tension on the unloading path.

Figure 11

FIG. 12.Increase of creep indentation depth during the fourth hold step for each individual indentation; comparison of experiment and simulation.