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High-temperature stable single carrier hole only device based on conjugated polymers

Published online by Cambridge University Press:  13 July 2018

Shahidul Alam*
Affiliation:
Center for Energy and Environmental Chemistry Jena (CEEC Jena), Friedrich Schiller University Jena, Jena 07743, Germany; and Laboratory of Organic and Macromolecular Chemistry (IOMC), Friedrich Schiller University Jena, Jena 07743, Germany
Peter Fischer
Affiliation:
Institute of Materials Engineering, Technische Universität Ilmenau, Ilmenau 98693, Germany
Christian Kästner
Affiliation:
Institute of Thermodynamics and Fluid Mechanics, Technische Universität Ilmenau, Ilmenau 98693, Germany
Chetan R. Singh
Affiliation:
Department of Macromolecular Chemistry I, University of Bayreuth, Bayreuth D-95440, Germany
Ulrich S. Schubert
Affiliation:
Center for Energy and Environmental Chemistry Jena (CEEC Jena), Friedrich Schiller University Jena, Jena 07743, Germany; and Laboratory of Organic and Macromolecular Chemistry (IOMC), Friedrich Schiller University Jena, Jena 07743, Germany
Harald Hoppe*
Affiliation:
Center for Energy and Environmental Chemistry Jena (CEEC Jena), Friedrich Schiller University Jena, Jena 07743, Germany; and Laboratory of Organic and Macromolecular Chemistry (IOMC), Friedrich Schiller University Jena, Jena 07743, Germany
*
a)Address all correspondence to these authors. e-mail: shahidul.alam@uni-jena.de

Abstract

Thin hole transport layers are important elements in organic semiconductor-based devices. Metal oxides are an encouraging material class for this purpose, as they may provide sufficient hole conduction in combination with excellent electron blocking properties. Both, long-term device stability, which may often be limited by the thermal stability of interfaces, and higher temperature processing steps, benefit strongly from the existence of thermally stable metal oxide interlayers. Provided that thermally stable electrodes can be fashioned, the stability of organic active layers—for example, in organic field effect transistors, light emitting diodes, or photovoltaic (OPV) devices can be investigated. Here, we apply this concept and report about the study of hole mobility (µh) in single-carrier-hole-only devices in dependence of thermal annealing up to the above the actual melting temperature of regio-regular poly(3-hexylthiophene-2,5-diyl) (P3HT).

Information

Type
Invited Article
Copyright
Copyright © Materials Research Society 2018 
Figure 0

FIG. 1. Energy level diagram of the materials are used in the studies21,22 (a), an exemplary SCLC device architecture (b), and the chemical formula of regio-regular P3HT (c) are depicted.

Figure 1

TABLE I. Overview of the experimental variation of HTLs.

Figure 2

FIG. 2. Diode-characteristics of asymmetric SCLC devices recorded at room temperature and plotted on a semilogarithmic scale. (a) Glass/Au/PEDOT:PSS/P3HT/Au/glass, (b) glass/Au/P3HT/PEDOT:PSS/Au/glass, (c) glass/Au/MoO3/P3HT/Au/glass, and (d) glass/Au/P3HT/MoO3/Au/glass.

Figure 3

FIG. 3. Diode characteristics of symmetric SCLC devices recorded at room temperature and plotted on a semilogarithmic scale. (a) Glass/Au/PEDOT:PSS/P3HT/PEDOT:PSS/Au/glass and (b) glass/Au/MoO3/P3HT/MoO3/Au/glass.

Figure 4

FIG. 4. SCLC fits using Murgatroyd formula and the J–V characteristics were corrected for the built-in voltage (Vbi) and the voltage drop over the contacts.

Figure 5

FIG. 5. SCLC hole mobilities obtained from symmetric devices subjected to no (as cast) and annealing at elevated temperatures up to 250 °C. The mobility values were determined by fitting the J–V characteristics according to Eq. (1).

Figure 6

TABLE II. Extracted SCLC hole mobilities obtained from symmetric devices subjected to different thermal annealing conditions up to 250 °C. The mobility values were determined from SCLC fits, and a minimum fitting error occurred for the respective built-in voltage [Vbi] reported.

Figure 7

FIG. 6. AFM topography images (2 × 2 µm) showing PEDOT:PSS and MoO3 films on Au, which have been annealed at 150, 200, and 250 °C. As-cast films are shown as a reference as well. In general, no much change is observed. Upper row: PEDOT:PSS films annealed at (a) as-cast, (b)150 °C, (c) 200 °C, and (d) 250 °C, lower row: MoO3 films annealed at (e) as-cast, (f) 150 °C, (g) 200 °C, and (h) 250 °C, respectively.

Figure 8

FIG. 7. Work function of bottom and top HTLs (PEDOT:PSS and MoO3).