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Intrinsically stretchable field-effect transistors

Published online by Cambridge University Press:  02 February 2017

Jiajie Liang
Affiliation:
School of Materials Science and Engineering, Key Laboratory of Functional Polymer Materials of Ministry of Education, Institute of Polymer Chemistry, Nankai University, China; liang0909@nankai.edu.cn
Kwing Tong
Affiliation:
Department of Materials Sciences and Engineering, Henry Samuli School of Engineering and Applied Science, University of California, Los Angeles, USA; kwing.tong@gmail.com
Huibin Sun
Affiliation:
Department of Materials Sciences and Engineering, Henry Samuli School of Engineering and Applied Science, University of California, Los Angeles, USA; sunhuibin003@gmail.com
Qibing Pei
Affiliation:
University of California, Los Angeles, USA; qpei@seas.ucla.edu

Abstract

A thin-film field-effect transistor (TFT) is a three-terminal device comprising source, drain, and gate electrodes, a dielectric layer, a semiconductor layer, and a substrate. The TFT is a fundamental building component in a variety of electronic devices. Developing an intrinsically stretchable TFT entails availability and usage of a functional material with elastomeric deformability in response to an externally applied stress. This represents a major materials challenge. In this article, we survey strategies to synthesize these elastomeric functional materials, and how these materials are assembled to fabricate intrinsically stretchable TFT devices. Developing solution-based printing technology to assemble intrinsically stretchable TFTs is considered a prospective strategy for wearable electronics for industrial adaptation in the near future.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2017 
Figure 0

Figure 1. The synthetic route of poly(dimethylsiloxane) (PDMS) cross-linked through coordination of metal ions to bipyridine (bpy) moieties. Reprinted with permission from Reference 11. © 2016 American Chemical Society.

Figure 1

Figure 2. (a) Scanning electron microscope image of the wrinkled Al2O3 layer. The inset shows a macroscopic wrinkle (scale bar = 1 µm). (b) A schematic of the air-gap model in which the total device capacitance (Ctot) is treated as the capacitance of the Al2O3 layer (Cox) and that of an air gap of thickness tair (Cair) connected in series. Note: CNT, carbon nanotube. Reprinted with permission from Reference 8. © 2013 Macmillan Publishers Ltd.

Figure 2

Figure 3. (a) Optical microscope images of graphene-based thin-film field-effect transistors (TFTs) under substrate stretching up to 5% along the longitudinal direction of the channel. (b) Typical transfer characteristics of graphene-based TFTs on poly(dimethylsiloxane) under various strains. Reprinted with permission from Reference 9. © 2011 American Chemical Society.

Figure 3

Figure 4. (a) Schematic showing transfer and buckling of a semiconducting carbon nanotube (semi-SWNT) film on poly(dimethylsiloxane) (PDMS), followed by fabrication of stretchable SWNT-based thin-film field-effect transistors (TFTs). (b) Optical image of electrodes after buckling. (c) Optical micrograph of a SWNT-based TFT. Reprinted with permission from Reference 16. © 2014 American Chemical Society. Note: CNT, carbon nanotube.

Figure 4

Figure 5. (a–b) Schematic illustration of the fabrication steps for a stretchable semiconducting carbon nanotube (semi-SWNT)-based thin-film field-effect transistor on a poly(urethane acrylate) (PUA) elastomeric substrate, with spray-printed silver nanowire (AgNW) electrodes. The scanning electron microscope (SEM) image in (a) shows the AgNW-PUA composite source/drain electrodes covered with a semi-SWNT layer (100-mm channel length) and an elastomeric dielectric copolymer (EDC) layer. Inset in (b) is a cross-sectional SEM image showing the SWNTs embedded into and wrapped by the dielectric layer. (c) Photographs of a device at specified strains applied along the channel length direction.2

Figure 5

Figure 6. (a) Schematic of the fabrication process for a stretchable organic-based thin-film field-effect transistor with a poly(3-hexylthiophene) (P3HT) channel layer, polyurethane (PU) dielectric, carbon nanotube (CNT) source and drain electrodes, and a eutectic gallium indium (EGaIn) gate electrode. Microscope image of a device with (b) zero and (c) 150% applied strain. (d) Transfer curves for a device stretched to 160% and released to 20%. The source–drain bias was −20 V and the channel width-length ratio (W/L) is 40. Reprinted with permission from Reference 7. © 2014 Wiley.