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Primary dendrite distribution in directionally solidified Sn–36 at.% Ni peritectic alloy

Published online by Cambridge University Press:  28 November 2012

Peng Peng
Affiliation:
Department of Materials Engineering, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, People’s Republic of China
Xinzhong Li*
Affiliation:
Department of Materials Engineering, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, People’s Republic of China
Yanqing Su
Affiliation:
Department of Materials Engineering, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, People’s Republic of China
Dongmei Liu
Affiliation:
Department of Materials Engineering, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, People’s Republic of China
Jingjie Guo
Affiliation:
Department of Materials Engineering, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, People’s Republic of China
Hengzhi Fu
Affiliation:
Department of Materials Engineering, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, People’s Republic of China
*
a) Address all correspondence to this author. e-mail: hitlxz@126.com

Abstract

The primary dendrite arm spacing and its distribution at the solid–liquid interface has been examined in directionally solidified Sn–36 at.% Ni peritectic alloys under constant temperature gradient in a range of growth rates (2–200 μm/s). Statistical analysis of the primary dendrite arm spacing on transverse sections has been carried out using the minimum spanning tree and Voronoi polygon. The frequency distribution of the number of nearest neighbors determined by the Voronoi polygon suggested that the arrangement of dendrites at the solid–liquid interface could be visualized as hexagonal tessellation. The primary dendrite arm spacing determined by the conventional area counting method and minimum spanning tree all decreased with increasing growth rate, and a range of primary dendrite spacing was present during solidification. The range first increased with increasing growth rate, but when the growth rate exceeded 20 μm/s, it turned to decrease, which can be attributed to disorder induced by growth rate and interdendritic convection.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2012
Figure 0

FIG. 1. The relevant part of Sn–Ni binary phase diagram.25

Figure 1

FIG. 2. Morphology of the solid–liquid interface of directionally solidified Sn–36 at.% Ni peritectic alloys at different growth rates: (a), (a1) v = 10 μm/s; (b), (b1) v = 20 μm/s; (c), (c1) v = 40 μm/s; and (d), (d1) v = 200 μm/s.

Figure 2

FIG. 3. Typical microstructural analyses illustrated for directionally solidified Sn–36 at.% Ni peritectic alloy at growth rate of 20 μm/s: (a) transverse image of solid–liquid interface, (b) centers of mass of dendrites, (c) MST based on (b), and (d) frequency distribution of the branch lengths obtained from the MST.

Figure 3

FIG. 4. Voronoi polygons directionally solidified Sn–36 at.% Ni peritectic alloy at growth rate of 20 μm/s: (a) number of nearest neighbors is indicated for each polygon and (b) relative frequency distribution of the number of nearest neighbors.

Figure 4

FIG. 5. Growth rate dependence of primary dendrite distribution of directionally solidified Sn–36 at.% Ni alloys: (a) the range of primary spacing and (b) maximum to minimum MST branch length ratio.

Figure 5

FIG. 6. Frequency distribution of the number of nearest neighbors obtained from the Voronoi polygons of dendrites on the transverse sections of directionally solidified Sn–36 at.% Ni alloys at different growth rates: (a) frequency and (b) the A2/A1ratio.

Figure 6

FIG. 7. Comparison of the primary dendrite arm spacing determined by the MST with the spacing determined by the conventional area method in directionally solidified Sn–36 at.% Ni alloys.