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Thermoelectric materials for middle and high temperature ranges

Published online by Cambridge University Press:  01 June 2015

Ryoji Funahashi*
Affiliation:
Inorganic Functional Materials Research Institute, National Institute of Advanced Industrial Science & Technology, 1-8-31 Midorigaoka, Ikeda, Osaka 563-8577, Japan
Tristan Barbier
Affiliation:
Inorganic Functional Materials Research Institute, National Institute of Advanced Industrial Science & Technology, 1-8-31 Midorigaoka, Ikeda, Osaka 563-8577, Japan
Emmanuel Combe
Affiliation:
Inorganic Functional Materials Research Institute, National Institute of Advanced Industrial Science & Technology, 1-8-31 Midorigaoka, Ikeda, Osaka 563-8577, Japan
*
a)Address all correspondence to this author. e-mail: funahashi-r@aist.go.jp

Abstract

Thermoelectric generation is one of the strongest candidates for recovering the waste heat from industry and transportation. Some of oxides and silicides are considered to be promising thermoelectric materials because of their high oxidation resistance. Several types of modules using p-type Ca3Co4O9/n-type CaMnO3 and p-type MnSi1.75/n-type Mn3Si4Al2 have been prepared and shown around 4 kW/m2 of maximum power density. The present study described the challenging enhancement of the thermoelectric figure of merit ZT of both oxide and silicide compounds. Introduction of secondary phases and low bulk density using a partial melting method is found to be effective for reducing phonon thermal conductivity in the promising Bi2Sr2Co2Ox. The grain size and distribution of the secondary phases can be controlled by optimizing the parameters of the partial melting method. On the other hand, detailed crystallographic structure of a new n-type Mn3Si4Al2 is clarified and leads to the enhancement of the ZT values by elemental substitution.

Information

Type
Review
Copyright
Copyright © Materials Research Society 2015 
Figure 0

FIG. 1. Distribution of waste heat with temperatures higher than 473 K against the temperature from the industry in Japan for (a) the net energy and (b) the reduced one by Carnot efficiency (ΔT/TH).4 The cold side temperature is fixed at 353 K.

Figure 1

FIG. 2. Hot-side temperature dependence of thermoelectric conversion efficiency for different ZT values. The cold-side temperature is fixed at 353 K.

Figure 2

FIG. 3. Schematic crystallographic structure of (a) Ca3Co4O9 and (b) Bi2Sr2Co2O9.

Figure 3

FIG. 4. Temperature dependence of ZT for (a) Ca3Co4O9 and (b) Bi2Sr2Co2O9 single crystals.

Figure 4

FIG. 5. Heat source temperature dependence of output power and density of power against the surface of the Al2O3 substrate of Ca3Co4O9/CaMnO3 thermoelectric modules.

Figure 5

FIG. 6. (a) Temperature dependence of Seebeck coefficient and electrical resistivity and (b) thermal conductivity and dimensionless figure of merit ZT for the Mn3Si4Al2 bulk.

Figure 6

FIG. 7. (a) Electrical resistivity measured continuously at 873 K in air and (b) XRD patterns before (i) and after (ii) the continuous measurement at 873 K for 48 h in air for the Mn3Si4Al2 sample. Diffraction peaks of secondary phases are observed after testing and are pointed out by arrows.

Figure 7

FIG. 8. (a) A photograph of the Mn3Si4Al2/MnSi1.7 module and (b) hot-side temperature dependence of output power measured in air.

Figure 8

FIG. 9. (a) Scanning electron micrographs of Bi2Sr2Co2O9 bulk materials quenched from the partial melting state at 1196 K and (b) after complete solidification by slow cooling.

Figure 9

FIG. 10. (a) Scanning electron micrographs of Bi2Sr2Co2O9 bulk materials prepared by: conventional sintering at 1183 K, (b) hot pressing at 1123 K, partial melting process [(c) temperatures of 1196 and (d) 1213 K], and (e) combined partial melting hot pressing heat treatment. Secondary phase is shown by arrows in the micrograph of the sample prepared by a partial melting process at 1213 K.

Figure 10

TABLE I. Average grain size, bulk density, and relative density against the theoretical value for the different Bi2Sr2Co2O9 bulk materials prepared in this study.

Figure 11

FIG. 11. X-ray powder diffraction of the different Bi2Sr2Co2O9 bulk materials.

Figure 12

FIG. 12. Transmission electron micrographs of secondary phases observed in Bi2Sr2Co2O9 samples prepared by a partial melting technique. Secondary phases are represented by arrows.

Figure 13

FIG. 13. (a) Temperature dependence of electrical resistivity ρ for the different Bi2Sr2Co2O9 bulk materials prepared by: conventional sintering at 1183 K, (b) hot pressing at 1123 K, partial melting process [(c) temperatures of 1196 and (d) 1213 K], and (e) combined partial melting hot pressing heat treatment. Secondary phase is shown by arrows in the micrograph of the sample prepared by a partial melting process at 1213 K.

Figure 14

FIG. 14. (a) Temperature dependence of the lattice part of the thermal conductivity λL for the different Bi2Sr2Co2O9 bulk materials prepared by: conventional sintering at 1183 K, (b) hot pressing at 1123 K, partial melting process [(c) temperatures of 1196 and (d) 1213 K], and (e) combined partial melting hot pressing heat treatment.

Figure 15

FIG. 15. (a) Temperature dependence of the Seebeck coefficient S values for the different Bi2Sr2Co2O9 bulk materials prepared by: conventional sintering at 1183 K, (b) hot pressing at 1123 K, partial melting process [(c) temperatures of 1196 and (d) 1213 K], and (e) combined partial melting hot pressing heat treatment.

Figure 16

TABLE II. Atomic content and chemical composition of the main phases in the different prepared Bi2Sr2Co2O9 bulk materials.

Figure 17

FIG. 16. (a) Evolution of the dimensionless figure of merit ZT with temperature for the different Bi2Sr2Co2O9 bulk materials prepared by: conventional sintering at 1183 K, (b) hot pressing at 1123 K, partial melting process [(c) temperatures of 1196 and (d) 1213 K], and (e) combined partial melting hot pressing heat treatment.

Figure 18

TABLE III. Crystal data and data collection parameters for Mn3Si4Al2.

Figure 19

FIG. 17. ED patterns (A) along (i) [001], (ii) [100], (iii) [1-10], and (iv) [-111] and (B) lattice image of Mn3Si4Al2.

Figure 20

FIG. 18. Schematic representation of the layered Mn3Si4Al2 compound.

Figure 21

FIG. 19. Powder XRD pattern of Mn3Si4Al2; final observed (points) and calculated (solid line) patterns.

Figure 22

TABLE IV. Crystallographic parameters of Mn3Si4Al2 deduced from x-ray powder Rietveld refinement at room temperature.

Figure 23

FIG. 20. (a) Temperature dependence of Seebeck coefficient and (b) electrical resistivity for Mn3Si4Al2 (nonsubstituted sample) and Mn2.7M0.3Si4Al2 (M: Ti, V, Cr, Fe, Co, Ni, and Cu).

Figure 24

FIG. 21. Changing of a- and c-cell parameters (a) and composition ratio of each element (b) with Cr substitution level for Mn3−xCrxSi4Al2.

Figure 25

FIG. 22. Cr substitution level dependence of Seebeck coefficient and electrical resistivity for Mn3−xCrxSi4Al2.

Figure 26

TABLE V. Seebeck coefficient S, electrical resistivity ρ, and power factor S2/ρ for Mn3−xCrxSi4Al2, Mn3Si4Al2−xGex, and Mn3Si4Al2−xInx at 573 and 773 K.

Figure 27

FIG. 23. Ge and In substitution level dependence of Seebeck coefficient and electrical resistivity for Mn3Si4Al2−xGex and Mn3Si4Al2−xInx.