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Topological memory using phase-change materials

Published online by Cambridge University Press:  10 May 2018

Junji Tominaga*
Affiliation:
Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Japan; j-tominaga@aist.go.jp

Abstract

Nonvolatile memories (NVMs) are key devices in computers to save a user’s information. Besides flash memory, several types of NVMs that use magnetoresistance, resistance change of metal oxides, and phase change of chalcogenide alloys have been studied. Among these, phase-change random-access memory (PC-RAM) is competitive from the viewpoint of switching speed, high durability, and scalability. In 2017, Intel and Micron Technology shipped commercial devices named Optane that use a phase-change material as storage class memories. Condensed-matter physicists have recently been attracted to phase-change materials because of their functionality as topological insulators. If the topological phase state is controllable and applied to PC-RAM, electron spin transfer and storage effects will be further available in addition to electrical resistance switching.

Information

Type
Materials for Advanced Semiconductor Memories
Copyright
Copyright © Materials Research Society 2018 
Figure 0

Figure 1. Cross-sectional transmission electron micrograph of 7.5-nm (width) × 17-nm (length) confined phase-change memory cells. (a) Array of memory cells, and (b) zoomed-in view of a single cell. Note: PCM, Ge-Sb-Te alloy phase-change film; BEC, bottom electric contact. Reprinted with permission from Reference 13. © 2010 IEEE.

Figure 1

Figure 2. Metamaterial (superlattice) film composed of [(GeTe)2(Sb2Te3)1]20 blocks deposited on a Si wafer under a stress-free condition.17

Figure 2

Figure 3. Primitive cells of the [(GeTe)2(Sb2Te3)1] superlattice and the band-structure difference. (a) High-resistive phase (called RESET-state) with spatial inversion symmetry and (b) low-resistive ferroelectric phase (called SET-state) with broken symmetry. Note: EF, Fermi energy; M, Γ, and K are k-points in the reciprocal lattice.38

Figure 3

Figure 4. (a) Magnetoresistance under different magnetic field strengths of 0.8, 1.0, and 1.2 kOe, and (b) the associated resistance hysteresis in a typical interfacial phase-change memory [(GeTe)2/(Sb2Te3)4]8 device (see inset) at room temperature. Magnetoresistance hysteresis occurs after the electric field (E) is turned off with a magnetic field (B) still present. The black circles indicate the initial resistance (R) without an applied magnetic field, the blue circles indicate resistance values with a magnetic field, the red circles indicate the first R–V curve after removal of the magnetic field, and finally the black triangles correspond to the second R–V cycle after the magnetic field was turned off. In each process, the initial and terminated states were both RESET.38 Note: V, voltage.

Figure 4

Figure 5. Resistance change at 300 K of [(GeTe)L(Sb2Te3)1]12 (L = 2). (a) (Top) Crosspoint device structure and (bottom) transmission electron microscope image. (b) Resistance (R) responses to external magnetic field after 4 h thermal annealing under a magnetic field (TAUM) treatment with current pulses (I, ±100 μA). Blue and orange lines show the current flow directions from bottom to top, and from top to bottom electrodes (E), respectively. Magnetic field (B) was scanned from –0.5 T to +0.5 T.34 Note: STEM, scanning transmission electron microscope; HAADF, high-angle annular dark field; SL, superlattice.