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Enhanced radiation tolerance in immiscible Cu/Fe multilayers with coherent and incoherent layer interfaces

Published online by Cambridge University Press:  17 February 2015

Youxing Chen
Affiliation:
Department of Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA
Engang Fu
Affiliation:
State Key Laboratory of Nuclear Physics and Technology, School of Physics, Peking University, Beijing 100871, People's Republic of China
Kaiyuan Yu
Affiliation:
Department of Materials Science and Engineering, China University of Petroleum-Beijing, Beijing 102249, People's Republic of China
Miao Song
Affiliation:
Department of Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA
Yue Liu
Affiliation:
Department of Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA
Yongqiang Wang
Affiliation:
Materials Science and Technology Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA
Haiyan Wang
Affiliation:
Department of Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA; and Department of Electrical and Computer Engineering, Texas A&M University, College Station, Texas 77843, USA
Xinghang Zhang*
Affiliation:
Department of Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA; and Department of Mechanical Engineering, Texas A&M University, College Station, Texas 77843, USA
*
a) Address all correspondence to this author. e-mail: zhangx@tamu.edu

Abstract

Recent studies have shown that chemical immiscibility is important to achieve enhanced radiation tolerance in metallic multilayers as immiscible layer interfaces are more stable against radiation induced mixing than miscible interfaces. However, as most of these immiscible systems have incoherent interfaces, the influence of coherency on radiation resistance of immiscible systems remains poorly understood. Here, we report on radiation response of immiscible Cu/Fe multilayers, with individual layer thickness h varying from 0.75 to 100 nm, subjected to He ion irradiation. When interface is incoherent, the peak bubble density decreases with decreasing h and reaches a minimum when h is 5 nm. At even smaller h when interface is increasingly coherent, the peak bubble density increases again. However, void swelling in coherent multilayers with smaller h remains less than those in incoherent multilayers. Our study suggests that the coherent immiscible interface is also effective to alleviate radiation induced damage.

Figure 0

FIG. 1. The depth profile of radiation damage in unit of dpa (left) and He concentration obtained from SRIM simulation in Cu50Fe50 subjected to He ion irradiation at 100 keV with a total dose of 6 × 1016 ions/cm2 (right). The peak damage and peak He concentration are approximately 2.5 dpa and 3 at.% (or 30,000 appm).

Figure 1

FIG. 2. XRD patterns of as-deposited (AD) and He ion irradiated Cu/Fe multilayers. (a) Radiation induced reduction of peak intensity and insignificant peak shift for multilayers with individual layer thicknesses varying from 2.5 to 100 nm on Si (110). Coherency between Cu and Fe became dominant when h = 2.5 nm as no BCC Fe peak can be detected. (b) When h = 0.75 nm, fully coherent (100) and (111) interfaces formed in AD Cu/Fe multilayers on Si (100) and Si (110) substrates. After radiation, shoulders appeared in prominently broadened (111) and (200) peaks, and the deconvolution of each peak displays three sub-peaks, P1, P2, and P3.

Figure 2

FIG. 3. (a) A low-magnification XTEM micrograph of He ion irradiated incoherent (FCC/BCC) Cu/Fe 100 nm multilayer on Si (110) substrate, superimposed with SRIM simulated He concentration profile (blue). (b) and (c) display the microstructure of the Cu and Fe layers at higher magnification (labeled as boxes in (a)). High-density He bubbles were clearly observed. The average bubble size is ∼1.3 nm.

Figure 3

FIG. 4. (a) A panoramic XTEM micrograph of He ion irradiated Cu/Fe 5 nm multilayer on Si (110) substrate with embedded He concentration profile. (b) and (c) display magnified images of the box b and c labeled in (a). (b) Most He bubbles were aligned along interfaces. (c) Bubble density increased and Cu/Fe interfaces became preferred locations for He bubbles. The average bubble size is ∼1.8 nm.

Figure 4

FIG. 5. Cross-sectional scanning TEM (STEM) micrographs of irradiated Cu/Fe 5 nm multilayer film on Si (110) substrate showing microstructures at three locations: (a) close to surface, (b) peak damage area, and (c) unirradiated area. Layer interface retained in irradiated multilayers. (d) Comparisons of compositional line profiles obtained from the peak damage area in (b) and unirradiated area in (c) show modulated variation of Cu and Fe compositions across layer interface, implying insignificant intermixing after He ion radiation.

Figure 5

FIG. 6. (a) A STEM image of as-deposited (111) Cu/Fe 0.75 nm multilayer showing chemically abrupt layer interfaces. (b) A high-resolution STEM image revealing coherent interfaces between Cu and Fe. (c) A high-resolution TEM image and (d) FFT-filtered image displaying coherent interfaces between Cu and Fe in as-deposited (100) Cu/Fe 0.75 nm multilayer. Fe in both systems has undergone phase transformation from BCC to FCC Fe.

Figure 6

FIG. 7. (a) A panoramic XTEM micrograph that overviews the microstructure of He ion irradiated fully coherent Cu/Fe 0.75 nm multilayer on Si (100). The evolution of bubble density is consistent with the superimposed He concentration profile (blue curve). (b), (c), and (d) display the respective magnified images of the irradiated films at locations b–d shown as boxes in (a). (b) Close to surface, low-density bubbles were randomly distributed. (c) High-density He bubbles appeared in the peak damage area. No clear layer interfaces were observed in both (b) and (c). However, the structure remained fully coherent and single-crystal-like, as shown in the embedded SAD pattern in (a). (d) In the region close to the end of He concentration profile, layer interface retained, and arrays of low-density He bubbles (with a diameter of ∼1 nm or less) with an average separation distance of 1.5 nm were observed. The smaller size of He bubbles (comparing to those in thicker multilayers) appears to be curtailed by the individual layer thickness. Furthermore, if bubbles reside at layer interfaces, the average spacing of aligned arrays of He bubbles should be 0.75 nm. Thus, we speculate that He bubbles may nucleate primarily within the layers.

Figure 7

FIG. 8. (a) An XTEM micrograph that overviews the microstructure of He ion irradiated fully coherent Cu/Fe 0.75 nm multilayer on Si (110). The evolution of bubble density is consistent with the superimposed He concentration profile (blue curve). (b) and (c) display the respective magnified images of the irradiated films at locations b and c shown as boxes in (a). (b) Close to surface, bubbles were randomly distributed. (c) High-density He bubbles formed in the peak damage area. No clear layer interfaces were detected in both (b) and (c).

Figure 8

FIG. 9. A statistical study of He bubble density distribution versus penetration depth in irradiated Cu/Fe 100, 25, and 5 nm multilayers on Si (110) substrates and Cu/Fe 0.75 nm multilayer on Si (100) substrate. The evolution of He bubble density matched closely to that of He concentration profile.

Figure 9

FIG. 10. (a) The variation of peak He bubble density with layer thickness h shows that with the decrease in h, the peak bubble density firstly decreases continuously and reaches a minimum value when h = 5 nm, and bounces back rapidly when h < 5 nm. The peak bubble densities of Cu/Fe 0.75 multilayers are comparable to those of pure Cu films. (b) The evolution of bubble size has an opposite trend to that of peak bubble density. (c) Swelling is estimated based on the bubble densities and sizes. When h = 5–100 nm, swelling does not change significantly. The optimized swelling reaches at h = 2.5 nm and the magnitude of swelling bounces back slightly with further decrease of h to 0.75 nm.

Figure 10

FIG. 11. (a) Schematics illustrate that in incoherent Cu/Fe 5 nm multilayer, He bubbles align predominantly along layer interfaces. (b1) Prior to radiation of fully coherent immiscible Cu/Fe 0.75 nm multilayer, Cu is under compression and Fe is under tension. (b2) After radiation, He bubbles prefer to nucleate in Cu layers and are constricted to reside inside Cu layers.