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Focused electron beam-induced deposition at cryogenic temperatures

Published online by Cambridge University Press:  04 February 2011

M. Bresin
Affiliation:
College of Nanoscale Science and Engineering, University at Albany, Albany, New York 12203
B.L. Thiel
Affiliation:
College of Nanoscale Science and Engineering, University at Albany, Albany, New York 12203
M. Toth
Affiliation:
College of Nanoscale Science and Engineering, University at Albany, Albany, New York 12203FEI Company, Hillsboro, Oregon 97124
K.A. Dunn*
Affiliation:
College of Nanoscale Science and Engineering, University at Albany, Albany, New York 12203
*
a)Address all correspondence to this author. e-mail: kdunn1@uamail.albany.edu

Abstract

Direct-write, cryogenic electron beam-induced deposition (EBID) was performed by condensing methylcyclopentadienyl-platinum-trimethyl precursor onto a substrate at −155 °C, exposing the condensate by a 15 keV electron beam, and desorbing unexposed precursor molecules by heating the substrate to room temperature. Dependencies of film thickness, microstructure, and surface morphology on electron beam flux and fluence, and Monte Carlo simulations of electron interactions with the condensate are used to construct a model of cryogenic EBID that is contrasted to existing models of conventional, room temperature EBID. It is shown that material grown from a cryogenic condensate exhibits one of three distinct surface morphologies: a nanoporous mesh with a high surface-to-volume ratio; a smooth, continuous film analogous to material typically grown by room temperature EBID; or a film with a high degree of surface roughness, analogous to that of the cryogenic condensate. The surface morphology can be controlled reproducibly by the electron fluence used for exposure.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2011
Figure 0

FIG. 1.Schematic diagram illustrating the steps in the low temperature EBID process.

Figure 1

FIG. 2.Plan-view secondary electron images detailing the cryo-EBID process. (a) Pt precursor condensate at −155 °C showing a rough as-condensed surface. (b) Condensate after three regions were beam exposed, showing no immediate change in surface morphology at −155 °C. (c) Same field of view after reheating to room temperature. Irradiated material remains on the surface while nonirradiated precursor desorbs and is removed by the pumping system.

Figure 2

FIG. 3.SEM images illustrating three surface morphology regimes deposited at constant flux (7.4 × 106 μm−2s−1) and increasing fluence: (a) nanoporous mesh, (b) smooth, and (c) rough with 1.1 × 108, 3.7 × 108, and 8.9 × 108 μm−2 fluence, respectively.

Figure 3

FIG. 4.Deposits fabricated as a function of electron flux and fluence used for cryo-EBID. (a) Montage of secondary electron images of the deposits taken at room temperature. Each row corresponds to constant fluence but increasing flux (left to right); each column corresponds to constant flux but increasing fluence (bottom to top). (b) Summary of the resulting morphologies within the white rectangle shown in (a) [R, S, and M = Rough, Smooth, and Mesh morphology, respectively. Base flux = .2 × 106 μm−2s−1; base fluence = 3.5 × 107 μm−2.] Deposits outside this area are consistent with these results, but are omitted from the table for clarity.

Figure 4

FIG. 5.Deposit fabricated using an electron-beam exposure overlay method. (a) Plan-view SEM image with white lines to indicate several exposure areas. (b) Higher magnification image showing the abrupt boundaries between the rough, smooth, and mesh morphology regimes. (c) Cross-sectional SEM image showing the thicknesses of each morphology regime (dashed white line inserted as a guide for the eye). The thickness of the rough area is approximately the thickness of the original condensate.

Figure 5

FIG. 6.Monte Carlo simulations of electron energy (E) deposited into MeCpPtMe3 condensates (filled markers) on a Si substrate (nonfilled markers) per unit depth (Z) from the vacuum-condensate interface. Condensate thicknesses are shown in the figure; incident electron energy = 15 keV.

Figure 6

FIG. 7.Cross-sectional HRTEM micrograph of a “rough” deposit fabricated by cryogenic EBID. Inset: SADP of the sample.