Hostname: page-component-74656f9884-rdgjk Total loading time: 0 Render date: 2026-11-07T22:23:56.797Z Has data issue: false hasContentIssue false

Characterization of the intrinsic strength between epoxy and silica using a multiscale approach

Published online by Cambridge University Press:  24 April 2012

Denvid Lau
Affiliation:
Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Oral Büyüköztürk
Affiliation:
Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Markus J. Buehler*
Affiliation:
Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
*
a)Address all correspondence to this author. e-mail: mbuehler@mit.edu

Abstract

Organic–inorganic interfaces exist in many natural or synthetic materials, such as mineral–protein interfaces found in bone and epoxy–silica interfaces found in concrete construction. Here, we report a model to predict the intrinsic strength between organic and inorganic materials, based on a molecular dynamics simulation approach combined with the metadynamics method, used to reconstruct the free energy surface between attached and detached states of the bonded system and scaled up to incorporate it into a continuum model. We apply this technique to model an epoxy–silica system that primarily features nonbonded and nondirectional van der Waals and Coulombic chemical interactions. The intrinsic strength between epoxy and silica derived from the molecular level is used to predict the structural behavior of epoxy–silica interface at the macroscopic length scale by invoking a finite element approach using a cohesive zone model which shows a good agreement with existing experimental results.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2012
Figure 0

FIG. 1. The continuum epoxy–silica interface can be represented by a discrete grid model when the length scale goes down to nanoscale. The adhesion between each epoxy chain and the silica substrate can be represented by the WLC-based fracture model. Our proposed multiscale analysis is to deliver the mechanical properties derived in the WLC-based fracture model to the continuum macroscale through the implementation of a finite element analysis.

Figure 1

FIG. 2. (a) Atomistic model of the silica substrate in which the surface is cleaved in [001] crystallographic plane, (b) the epoxy chain with only one repeating unit, and (c) the epoxy chain is moved manually onto the silica substrate before carrying out the simulation.

Figure 2

FIG. 3. (a) Schematic diagram showing the definition of CV in epoxy–silica system. (b) It shows the convergence of the FES in the epoxy–silica system under different processing times. The surface energy of the system can be calculated by taken the energy difference between the attached and detached stages.

Figure 3

FIG. 4. (a) Single chain epoxy with a length Lbonded bonded with the silica substrate by a continuous van der Waals and Coulombic interactions is strained at the free end under a constant force F, (b) at the onset of rupture, the contour length increases due to the detachment of a piece of chain, and (c) qualitative description of the force–displacement behavior before and after debonding, with an illustration of the dissipation energy. It is noted that the model does not require the applied force to be in the shear direction as shown in panels (a) and (b). In fact, it is valid for other loading angles (shear, tear, or mixed) as we only consider the free energy change in the overhang of the epoxy chain.

Figure 4

FIG. 5. (a) The derivation of the maximum stress in the traction–separation relation for the epoxy–silica interface by considering the tributary area (s × s) for a single epoxy chain and (b) the prediction of k by curve fitting from the MD data via a harmonic function.

Figure 5

FIG. 6. Configuration of the interface fracture specimen that is tested by applying a peel load at the end of the CFRP strip.

Figure 6

FIG. 7. (a) The stress (σyy) distribution of the specimen at the peak of the load–displacement curve. Separation between epoxy and the substrate can be captured by the deformation of the cohesive element as shown in the close-up. (b) The load–displacement curves from the predictive model and experiment [1] are shown. The peak of the load–displacement curve from the experiment is close to our prediction when s = 2 nm, which is a reasonable distance between adjacent cross-links for a fully cured epoxy. The good agreement between our prediction and the experimental result implies that our multiscale model of interface can provide a reasonable estimate of the global structural behavior of the epoxy–silica interface. (c) A quantitative comparison of between the maximum load measured from the experiment and the predicted average peak load based on the three chosen s values is shown using a bar plot.

Figure 7

TABLE I. Predictions of the material properties at epoxy–silica interface.

Supplementary material: File

Lau et al. supplementary material

Supplementary text

Download Lau et al. supplementary material(File)
File 4.5 KB