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Concurrent dual-band SiGe HBT power amplifier for Wireless applications

Published online by Cambridge University Press:  10 March 2009

Vittorio Camarchia*
Affiliation:
Electronic Engineering Department – Politecnico di Torino, C.so Duca degli Abruzzi 24 Torino, 10129Italy.
Rocco Giofrè
Affiliation:
Electronic Engineering Department of theUniversity of Roma Tor Vergata, via del Politecnico n. 1, 00133 Roma, Italy.
Iacopo Magrini
Affiliation:
Department of Electronics and Telecommunications, University of Florence, V. S. Marta, 3, 50139 FlorenceItaly.
Luca Piazzon
Affiliation:
Electronic Engineering Department of theUniversity of Roma Tor Vergata, via del Politecnico n. 1, 00133 Roma, Italy.
Alessandro Cidronali
Affiliation:
Department of Electronics and Telecommunications, University of Florence, V. S. Marta, 3, 50139 FlorenceItaly.
Paolo Colantonio
Affiliation:
Electronic Engineering Department of theUniversity of Roma Tor Vergata, via del Politecnico n. 1, 00133 Roma, Italy.
Simona Donati Guerrieri
Affiliation:
Electronic Engineering Department – Politecnico di Torino, C.so Duca degli Abruzzi 24 Torino, 10129Italy.
Giovanni Ghione
Affiliation:
Electronic Engineering Department – Politecnico di Torino, C.so Duca degli Abruzzi 24 Torino, 10129Italy.
Franco Giannini
Affiliation:
Electronic Engineering Department of theUniversity of Roma Tor Vergata, via del Politecnico n. 1, 00133 Roma, Italy.
Marco Pirola
Affiliation:
Electronic Engineering Department – Politecnico di Torino, C.so Duca degli Abruzzi 24 Torino, 10129Italy.
Gianfranco Manes
Affiliation:
Department of Electronics and Telecommunications, University of Florence, V. S. Marta, 3, 50139 FlorenceItaly.
*
Corresponding author: V. Camarchia Email: vittorio.camarchia@polito.it
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Abstract

This paper presents an investigation of a concurrent low-cost dual-band power amplifier (PA) fabricated in SiGe technology, able to simultaneously operate at two frequencies of 2.45 and 3.5-GHz, including an evaluation of its system level performance potentiality. Taking into account the technology novelty and the lack of device characterization and modeling, a hybrid (MIC) approach has been adopted both for a fast prototyping of the PA and for the evaluation of the device potentiality based on an extensive linear and nonlinear characterization. The comparison of PA performance in single-band or concurrent mode operation will be presented. In particular, the measured PA prototype shows an output power of 17.2 and 17-dBm at a 1-dB compression point, at 2.45 and 3.5-GHz, respectively, for CW single-mode operation, with a power added efficiency around 20%. System-level analysis predicts that, when the PA is operated under the 20-MHz Orthogonal Frequency-Division Multiplexing (OFDM) concurrent signals, the maximum output power levels to maintain the Error Vector Magnitude (EVM) within 5% are 11 and 3.5-dBm at 2.45 and 3.5-GHz, respectively. Moreover, new concepts and possible new system architectures for the development of the next generation of the multi-band transceiver front-end will be provided with an extensive system-level evaluation of the amplifier.

Information

Type
Original Article
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2009
Figure 0

Fig. 1. Schematic of combined PAs.

Figure 1

Fig. 2. Schematic of adaptive PA.

Figure 2

Fig. 3. Schematic of the dual-band PA.

Figure 3

Fig. 4. Hybrid (MIC) PA prototype.

Figure 4

Fig. 5. HBT cross section.

Figure 5

Fig. 6. Static device DC characteristics.

Figure 6

Fig. 7. Scattering parameter S11 and S22 for the DUT in the bias point VCE = 4.5-V and IB = 0.4-mA selected for the PA design.

Figure 7

Fig. 8. Small signal gain S21 for the DUT in the bias point VCE = 4.5-V and IB = 0.4-mA selected for the PA design.

Figure 8

Fig. 9. Power sweep on optimum load (ΓL, f1) at the fundamental frequency of 2.45-GHz.

Figure 9

Fig. 10. Power sweep on optimum load (ΓL, f2) at the fundamental frequency of 3.5-GHz.

Figure 10

Fig. 11. Output matching network.

Figure 11

Fig. 12. Output matching network.

Figure 12

Fig. 13. Picture of PA input matching network.

Figure 13

Fig. 14. Picture of PA output matching network.

Figure 14

Fig. 15. Measured transmission S21 and matching S11 scattering parameters of the amplifier.

Figure 15

Fig. 16. Output power, power gain, and PAE vs. input power (Pin) at the fundamental frequency of 2.575-GHz.

Figure 16

Fig. 17. Output power, power gain, and PAE vs. input power (Pin) at the fundamental frequency of 3.4-GHz.

Figure 17

Fig. 18. Gain comparison of the large-signal single-tone and two-tone analyses of the concurrent dual-band PA.

Figure 18

Fig. 19. Comparison between spectra at 2.45-GHz in single-system operation (bottom figure) and in the presence of a concurrent system at 3.5-GHz (top figure). The graphs also report the large signal gain of the PA.

Figure 19

Fig. 20. Comparison between spectra at 3.5-GHz in the single-system operation (bottom figure) and in the presence of a concurrent system at 2.45-GHz (top figure). The graphs also report the large signal gain of the PA.

Figure 20

Table 1. EVM calculation for the dual-band PA.