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High permeability and high permittivity heterostructures for the miniaturization of Radiofrequency components

Published online by Cambridge University Press:  07 January 2010

Evangéline Bènevent*
Affiliation:
CEA, LETI, MINATEC, F38054 Grenoble, France. Phone: +334.38.78.02.75; Fax: +334.38.78.21.27. SPINTEC, CEA, CNRS, UJF, INPG; CEA/INAC, F38054 Grenoble, France.
Kevin Garello
Affiliation:
CEA, LETI, MINATEC, F38054 Grenoble, France. Phone: +334.38.78.02.75; Fax: +334.38.78.21.27. SPINTEC, CEA, CNRS, UJF, INPG; CEA/INAC, F38054 Grenoble, France. XLIM, CNRS, F87060 Limoges, France.
Dominique Cros
Affiliation:
XLIM, CNRS, F87060 Limoges, France.
Bernard Viala
Affiliation:
CEA, LETI, MINATEC, F38054 Grenoble, France. Phone: +334.38.78.02.75; Fax: +334.38.78.21.27. SPINTEC, CEA, CNRS, UJF, INPG; CEA/INAC, F38054 Grenoble, France.
*
Corresponding author: E. Bènevent Email: evangeline.benevent@gmail.com
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Abstract

This paper discusses on the miniaturization of radiofrequency (RF) front-end components such as half-wavelength resonators based on new magneto-dielectric heterostructures combining high permeability (µ = 150–250) and high permittivity (ε = 18–150). Size reduction is evaluated by means of 2-cm-long coplanar waveguides realized with silicon technology and having a resonance frequency of about 3 GHz. The experimental results show a physical length reduction of 11.2% due to the dielectric contribution (ε = 18) and 14.8% by cumulating dielectric and magnetic effects (ε = 18 and µ = 150). These results are significant with respect to the moderate thickness of the preliminary material used here (only 150 nm). In a second part, a predictive model is proposed with µ and ε as variables. When adjusting the material properties in a realistic way (µ = 250 and ε = 150), the model predicts size reduction of ~50% for the same thickness. Larger values can be expected with increasing the film thickness.

Information

Type
Original Article
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2010
Figure 0

Fig. 1. Structures of the unloaded-CPW (a) and loaded-CPW (b) on thermally oxidized silicon substrate.

Figure 1

Fig. 2. Phase constants of the unloaded- and loaded-CPWs (experimental results).

Figure 2

Fig. 3. Electrical equivalent circuits for unloaded-CPW (a) and loaded-CPW (b) on thermally oxidized silicon substrate.

Figure 3

Fig. 4. Attenuation constant of the unloaded- and loaded-CPWs (analytical and experimental results).

Figure 4

Fig. 5. Phase constant of the unloaded- and loaded-CPWs (analytical and experimental results).

Figure 5

Table 1. Synthesis of the analytical results.