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Aberration-corrected self-interference of split higher order Laue zone line for measuring the z-dependent strain profile

Published online by Cambridge University Press:  16 January 2017

Mana Norouzpour*
Affiliation:
CAMTEC, MENG, University of Victoria, British Colombia V8W 2Y2, Canada
Rodney Herring
Affiliation:
CAMTEC, MENG, University of Victoria, British Colombia V8W 2Y2, Canada
*
a) Address all correspondence to this author. e-mail: mananrp@Uvic.ca

Abstract

A common characteristic in semiconductor nanostructures is the lattice strain originating from the lattice mismatch between layers of different compositions. Three-dimensional strain measurement in crystals using transmission electron microscopy (TEM) techniques has been the subject of intense works for decades. This information is required for the strain-bandgap engineering being used by our current fast computers and necessary for future quantum computers. However, the missing information was the 3rd dimension that is the atomic displacement and how it changes along the electron-beam direction. The strain information along the electron-beam direction is in the phase of the diffracted beam, which has been obtained recently by the novel technique of self-interference of split higher order Laue zone line (SIS-HOLZ). SIS-HOLZ has been made possible by the correction of the beam aberrations having its analytical and experimental details reported here for the atomic displacement profile existing at the interface of a Si and Si/Si0.8Ge0.2 superlattice.

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Type
Articles
Copyright
Copyright © Materials Research Society 2017 
Figure 0

FIG. 1. A simplified diagram of the SIS-HOLZ technique. By applying a voltage on the biprism, the intensities passing either of its sides deflect toward each other by an angle of αB to self-interfere. The specimen is Si/Si0.8Ge0.2 superlattices on the Si substrate. The ROI for conducting the experiment was in the Si substrate close to the interface that is strained due to the lattice mismatch between Si and Si0.8Ge0.2. Here, S1 is from the bottom half side of the specimen and S2 comes from the top half side of the specimen, if the beam is under-focused as in the diagram.

Figure 1

FIG. 2. (a) A schematic of the cross-sectioned specimen, made by the lift out technique using the FIB, (b) low magnification STEHM image of six fabricated specimens with different thickness variation, and (c) high magnification STEHM image of specimen 1 showing Si/Si0.8Ge0.2 superlattices, Si capping layer and tungsten coating.

Figure 2

FIG. 3. The 000 CBED disk obtained along the 004 Kikuchi band showing the HOLZ line taken within the Si substrate at (a) 400 ± 10 nm (no split), at (b) 200 ± 10 nm (begin to split), at (c) 180 ± 10 nm, (d) 100 ± 10 nm, and at (e) 70 ± 10 nm (the largest split) away from Si/Si0.8Ge0.2 interface.

Figure 3

FIG. 4. The DF disk 008 split HOLZ line obtained away from Si and Si0.8Ge0.2 interface at (a) 400 ± 10 nm, at (b) 200 ± 10 nm, at (c) 180 ± 10 nm, at (d) 100 ± 10 nm and, at (e) 70 ± 10 nm showing an increase in the split width approaching the interface.

Figure 4

FIG. 5. (a) The DF disk 008 split HOLZ line, (b) the biprism with a negative potential centered within the split HOLZ line for the alignment purposes, (c) the intensity distribution across the split HOLZ line in (a), and (d) the intensity profile while the biprism is centered inside the split HOLZ line.

Figure 5

FIG. 6. (a) The interferogram of the self-interfered split HOLZ line showing fine fringes running parallel with the length of the HOLZ line, (b) the reconstructed phase image of (a) tilted horizontally for the presentation, (c) the phase profile passing through its width across the sketched box within the phase image.

Figure 6

FIG. 7. A schematic of a hypothetical z-dependent displacement profile of a bent crystal that Bragg diffracts the electron beam by the Bragg angle, θB. Due to the bent atomic planes, the constant θB keeps on tilting and deviating from its position for a perfect crystal causing the individual HOLZ line to split.

Figure 7

FIG. 8. A schematic of the phase profile across the split HOLZ line. When the biprism is off, there is no interference and only the split HOLZ line can be seen. When the biprism is on, the left and the right halves interfere.

Figure 8

FIG. 9. The calculated phase profile is compared with the experimental phase profile showing a reasonably good fit.

Figure 9

FIG. 10. The displacement profile at 80 nm distance from the interface along the z-axis, which is through the thickness of the crystal.

Figure 10

FIG. 11. A schematic of the frequency domain obtained by the FT of the interferogram. There is a center band and a side band. The carrier frequency of fringes must be at least three times larger than qm, to avoid overlapping the side bands and the center band. At least 3 fringes are required to reconstruct a phase image from an interferogram.