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Relationship between microstructure and thermoelectric properties of Bi2Sr2Co2Ox bulk materials

Published online by Cambridge University Press:  15 July 2014

Emmanuel Combe
Affiliation:
Research Institute for Ubiquitous Energy Devices, National Institute of Advanced Industrial Science and Technology, Ikeda, Osaka 563-8577, Japan
Ryoji Funahashi*
Affiliation:
Research Institute for Ubiquitous Energy Devices, National Institute of Advanced Industrial Science and Technology, Ikeda, Osaka 563-8577, Japan; and CREST, Japan Science and Technology Agency, Chiyoda, Tokyo 102-0075, Japan
Feridoon Azough
Affiliation:
Materials Science Center, School of Materials, University of Manchester, Manchester M13 9PL, United Kingdom
Robert Freer
Affiliation:
Materials Science Center, School of Materials, University of Manchester, Manchester M13 9PL, United Kingdom
*
a)Address all correspondence to this author. e-mail: funahashi-r@aist.go.jp

Abstract

The thermoelectric properties of Bi2Sr2Co2Ox (BSC-222) bulk materials prepared by three different processing methods, i.e., conventional sintering, hot pressing, or partial melting, were investigated and compared. The electrical current, temperature difference for Seebeck coefficient, and thermal diffusion were measured in the same direction. The hot pressing and partial melting are effective processing methods for improving the electrical transport property in BSC-222 bulk materials due to an improvement of density in hot-pressed samples or by grain growth during partial melting process. For partially melted samples, a decrease in the thermal conductivity is also observed. The highest dimensionless thermoelectric figure of merit (ZT) values have been obtained in the sample prepared by partial melting method, for which ZT has been increased by a factor of 2.7 by comparison with bulk materials prepared by conventional sintering. At 700 °C in air, ZT value reaches 0.27 for partially melted Bi2Sr2Co2Ox bulk materials. This study shows that optimized electrical and thermal transport properties can be achieved in BSC-222 bulk materials possessing microstructures with both large average grain size and appropriate bulk density.

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Articles
Copyright
Copyright © Materials Research Society 2014 
Figure 0

FIG. 1. Diagram detailing the different processing methods used for the preparation of Bi2Sr2Co2Ox bulk materials.

Figure 1

FIG. 2. Thermogravimetry and differential thermal analysis curves of Bi2Sr2Co2Ox green bulk.

Figure 2

FIG. 3. Electron backscattering images of the different cross-sections of Bi2Sr2Co2Ox bulk materials prepared in this study: green bulk material (a); samples prepared by conventional sintering at 910 °C (b); bulk materials prepared by hot pressing at 800 °C (c) and 850 °C (d) or partial melting at 923 °C (e) or 940 °C (f). Secondary phases observed in sample partially melted at 940 °C are indicated by arrows.

Figure 3

FIG. 4. Grain size histogram of the different BSC-222 prepared samples.

Figure 4

TABLE I. Average grain size and standard deviation, bulk density and relative density against theoretical value11 of the different Bi2Sr2Co2Ox bulk materials prepared by conventional sintering, hot pressing at 800 and 850 °C, or partial melting at 923 and 940 °C.

Figure 5

FIG. 5. Temperature dependence of the electrical resistivity ρ of the different BSC-222 prepared samples. Inset: schematic of the sample cutting for the measurement of electrical properties.

Figure 6

FIG. 6. Powder x-ray diffraction patterns of the Bi2Sr2Co2Ox samples prepared by partial melting at 923 °C (a) and 940 °C (b). The diffraction peaks due to secondary phases are indicated by the symbol # for the Bi3SrOx phase and * for the CoO phase.

Figure 7

FIG. 7. Temperature dependence of the Seebeck coefficient values S of the different BSC-222 prepared bulk materials. Inset: schematic of the sample cutting for the measurement of electrical properties.

Figure 8

FIG. 8. Temperature dependence of the thermal conductivity λ (a), including the electronic λe (b) or lattice contributions λL (c), for the different BSC-222 prepared bulk materials. Inset: schematic of the sample cutting for the measurement of thermal properties.

Figure 9

FIG. 9. Variation of the lattice part of the thermal conductivity λL versus bulk density in BSC-222 samples at 700 °C in air.

Figure 10

FIG. 10. Variation of the figure of merit ZT versus temperature for the BSC-222 bulk materials.