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Incipient straining in severe plastic deformation methods

Published online by Cambridge University Press:  04 March 2014

Fei Du*
Affiliation:
Harold and Inge Marcus Department of Industrial and Manufacturing Engineering, University Park, Pennsylvania 16802
Shwetabh Yadav
Affiliation:
Department of Civil Engineering, Indian Institute of Science, Bangalore, India 560012
Cesar Moreno
Affiliation:
Harold and Inge Marcus Department of Industrial and Manufacturing Engineering, University Park, Pennsylvania 16802
Tejas Gorur Murthy
Affiliation:
Department of Civil Engineering, Indian Institute of Science, Bangalore, India 560012
Christopher Saldana*
Affiliation:
Harold and Inge Marcus Department of Industrial and Manufacturing Engineering, University Park, Pennsylvania 16802
*
a) Address all correspondence to this author. e-mail: csaldana@psu.edu

Abstract

Knowledge of the plasticity associated with the incipient stage of chip formation is useful toward developing an understanding of the deformation field underlying severe plastic deformation processes. The transition from a transient state of straining to a steady state was investigated in plane strain machining of a model material system—copper. Characterization of the evolution to a steady-state deformation field was made by image correlation, hardness mapping, load analysis, and microstructure characterization. Empirical relationships relating the deformation heterogeneity and the process parameters were found and explained by the corresponding effects on shear plane geometry. The results are potentially useful to facilitate a framework for process design of large strain deformation configurations, wherein transient deformation fields prevail. These implications are considered in the present study to quantify the efficiency of processing methods for bulk ultrafine-grained metals by large strain extrusion machining and equal channel angular pressing.

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Articles
Copyright
Copyright © Materials Research Society 2014 
Figure 0

FIG. 1. (a) ECAP configuration and (b) LSEM configuration. Conventional machining is given by LSEM without the use of a constraint.

Figure 1

FIG. 2. Representative high-speed optical images of the cutting process at a0 = 500 μm with (a) α = 30°, (b) α = 15°, and (c) α = 5°.

Figure 2

TABLE I. Experimental deformation conditions and measured deformation parameters.

Figure 3

FIG. 3. (a) Velocity, (b) strain rate, and (c) strain field for a0 = 500 μm and α = 15°.

Figure 4

FIG. 4. (a) Strain profile for α = 15°, (b) strain profile for a0 = 500 μm, and (c) linear fit of length of incipient strain region versus undeformed chip thickness using PIV method.

Figure 5

TABLE II. Length of the incipient strain region (${l_0}$) versus undeformed chip thickness (${a_0}$) using PIV, hardness mapping, load measurement, and an average of these measures.

Figure 6

FIG. 5. (a) Hardness profile for α = 15°, (b) hardness-converted strain profile for α = 15°, and (c) linear fit of the length of the incipient strain region versus undeformed chip thickness using hardness method.

Figure 7

FIG. 6. (a) Load profile and loading slope curve for α = 15° and a0 = 500 μm, (b) loading slope curves for α = 15°, and (c) linear fit of the length of the incipient strain region versus undeformed chip thickness using the load method.

Figure 8

FIG. 7. Average length of the incipient strain region (l0) versus undeformed chip thickness (a0) with error bars for the range of experimental conditions.

Figure 9

FIG. 8. Evolution of microstructure from distorted microcrystalline grains to flow lines for a0 = 750 μm (top) and a0 = 250 μm (bottom) with α = 15°. The rake face of the chip marked as line RF, the chip end marked as line A, and the position of the first observable flow line marked as line B.

Figure 10

FIG. 9. Relationship of the length of the incipient strain region (l0) to shear plane length (${l_{{\rm{sp}}}}$) for the range of experimental conditions.

Figure 11

FIG. 10. Length of the incipient strain region (${l_0}$) as a function of strain for (a) ECAP (a0 = 10 mm, θ = 90°, ψ = 0°) and (b) LSEM (a0 = 10 mm, α = 0°).