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Instrumented indentation testing of arsenic triselenide–arsenic triiodide pseudobinary glasses with copper

Published online by Cambridge University Press:  17 October 2012

Svetlana R. Lukić-Petrović
Affiliation:
Department of Physics, Faculty of Sciences, University of Novi Sad, 21000 Novi Sad, Serbia
Ljubica R. Đačanin*
Affiliation:
Department of Physics, Faculty of Sciences, University of Novi Sad, 21000 Novi Sad, Serbia
Radenko V. Kisić
Affiliation:
Department of Physics, Faculty of Sciences, University of Novi Sad, 21000 Novi Sad, Serbia
Aleksandar M. Antić
Affiliation:
Department of Fundamental Sciences, Faculty of Technical Sciences, University of Novi Sad, 21000 Novi Sad, Serbia
*
a)Address all correspondence to this author. e-mail: ljubica@df.uns.ac.rs

Abstract

In this research, we performed experimental investigations of the influence of copper presence on hardness of arsenic triselenide (As2Se3)–arsenic triiodide (AsI3) pseudobinary glasses. The samples belong to the group of chalcogenide glasses, that, when compared with oxide glasses, can be synthesized much more easily in a wide variety of compositions, allowing also fine-tuning of their properties. Here, presence of iodine (I) facilitates glass formation, whereas addition of copper (Cu) creates possibility for interesting optoelectronic properties. As it is important to study mechanical properties of materials with respect to their fabrication and manipulation, we report results of instrumented indentation testing (IIT) of bulk samples of Cux[(As2Se3)0.9(AsI3)0.1]100−x with x = 5, 10, 20, and 25 at.% of Cu. This technique enables fast determination of indentation hardness, hardness value according to Vickers and indentation modulus directly from the indentation load–displacement curves. It was shown that all these parameters increase linearly with the increase of copper content. Improvement of the mechanical properties justifies the addition of Cu into the glass matrix.

Information

Type
Articles
Copyright
Copyright © Materials Research Society 2012
Figure 0

FIG. 1. Schematic illustration of the loading and unloading process, F—test force, hmax—maximum indentation depth at Fmax, hc—depth of the contact of the indenter with the test piece at Fmax, hs—permanent indentation depth after removal of the test force, hf—depth of the contact.16

Figure 1

FIG. 2. Typical load–displacement curves, obtained for the samples with 5 and 25 at.% Cu, with maximum loading force of 300 mN.

Figure 2

FIG. 3. Correlation between indentation hardness and Cu content for maximum loading force of 300 mN.

Figure 3

FIG. 4. Correlation between hardness according to Vickers and Cu content for maximum loading force of 300 mN.

Figure 4

FIG. 5. Correlation between indentation modulus and Cu content for maximum loading force of 300 mN.

Figure 5

FIG. 6. XRD patterns recorded at 420 °C, for Cux[(As2Se3)0.9(AsI3)0.1]100−x samples: (1) x = 5, (2) x = 10, (3) x = 20, (4) x = 25.

Figure 6

FIG. 7. Photograph of the imprint, Vickers direct method, the sample with 15 at.% Cu, applied load 30 g.

Figure 7

FIG. 8. Hardness according to Vickers versus the applied test force for glassy samples with different copper content.