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Division by current: a new approach to FET capacitance modeling

Published online by Cambridge University Press:  03 February 2011

Stephen Maas*
Affiliation:
Nonlinear Technologies, Inc., P.O. Box 7284, Long Beach, CA 90807, USA.
*
Corresponding author: S. Maas Email: s.maas@nonlintec.com
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Abstract

This paper introduces a new approach to the modeling of capacitance in field-effect transistor (FET) devices, which we call division by current. It is compared with existing formulations, which we call division by capacitance and division by charge. In doing so, it is necessary to normalize the theory of nonlinear capacitances and to clarify a number of matters. These include charge conservation and determination of charge functions from capacitance measurements, which are often misstated in the literature. We find the division by current formulation to be practical and to have significant advantages in the generation of FET models and in circuit simulation.

Information

Type
Research Article
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2011
Figure 0

Fig. 1. An FET's intrinsic gate-to-channel capacitance can be viewed as a kind of three-terminal capacitor, where the terminals are those of the FET. Any pair of branch voltages defines the capacitor's charge.

Figure 1

Fig. 2. Division-by-charge formulation: the three-terminal capacitor is represented by two separate nonlinear capacitors.

Figure 2

Fig. 3. Large-signal equivalent circuit of a FET's channel capacitance. Qg is a charge source.

Figure 3

Fig. 4. Transformation of the division-by-current equivalent circuit. (a) Shows the circuit, according to the original concept. In (b), the gate-to-drain current source has been transformed to a pair of shunt sources. In (c), the pair of gate-to-source current sources has been replaced by its equivalent, the gate-charge capacitance. Then, the division function remains only in the drain-to-source branch, where it can be treated simply as part of the channel current.

Figure 4

Fig. 5. Small-signal equivalent circuit derived from the large-signal equivalent circuit in Fig. 4(c).

Figure 5

Fig. 6. Values of charge are found by path integration of the capacitance in the (V1, V2) plane as indicated. As long as the model is charge conservative, any path may be used, although for practical reasons integrating along the axes is preferred.

Figure 6

Fig. 7. This figure illustrates the area of the (Vgs, Vgd) space that must be mapped, for a hypothetical device having approximately −1.0 V pinch-off. This is called the accessible region. Contours of constant Vds are shown as well. The accessible region is within the limits established by power dissipation, gate-to-channel conduction, and hard pinch-off. Furthermore, if the device is symmetrical, only the accessible region below the Vds = 0 contour must be mapped; the rest can be determined by symmetry.

Figure 7

Fig. 8. Dependence of is on vgd or id on vgs can be determined from Y-parameter measurements of the device in common-gate configuration.

Figure 8

Fig. 9. Measurements of Y parameters at Vds = 0 and various values of Vgs. The positive imaginary part of Y12 is a clear indication of a transcapacitance. Note that at Vds = 0, Y12 = Y21. The frequency range is 0.1–26 GHz.

Figure 9

Fig. 10. Small-signal equivalent circuit (a) and Y-parameter fitting (b) of the model.